Taiyo Yuden Co., Ltd.

Taiyo Yuden Kabushiki Kaisha

President of Kogyo Gijutuin

Kikuji Fukai

Koji Saito

Taro Yasuda

Hideyo Iida

Yutaka Hayashi

Kiyoshi Murase

Hiroshi Fukushima

Masaru Aoki

Takahiro Tanaka

Mizuho Imai

Mikio Sekiguchi

Kazushige Koyama

Hideo Shirouchi

Komei Kato

Atuo Itoh

Atsuo Ito

Yutaka Aikawa

Makoto Mineno

A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.

Method and apparatus for supplying chip parts

A supply apparatus for prism-shaped chip components has two relatively movable taking-in members. When the members move relative to each other, flat surfaces thereof contact each other and a parallel space is formed between the upper portions of the two taking-in members. Relative movement of the two talking-in members causes the components in a storage chamber to enter the parallel space between the upper portions of the two taking-in members. The components entering the parallel space have the same thickness-wise orientation and are lengthwise in a supply passageway in a one by one in a state. The components move downward by gravity in the supply passageway and then in a discharge passageway.

Electronic component supply apparatus

Method and apparatus for supplying electronic components

In an electronic component placing apparatus, four magazines are mounted on a head, and yet electronic components are housed in each magazine. In this apparatus, by an operation of selectively inserting a suction nozzle into four insertion openings in the magazines, it is possible to load a desired electronic component on a substrate, and this component loading can be repeatedly performed until the housed components are exhausted.

Electronic component placing apparatus

Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.

Method for supplying chip parts

Apparatus for supplying chip parts and a method for same

An atomizer for forming a thin film comprising an atomizing box, a guide tube having an open end of small diameter and an other open end of large diameter, a nozzle having an ejection outlet disposed in the atomizing box, an atomizing solution reservoir defined in the atomizing box adjacent to the open end of large diameter of the guide tube, and a fluid return passage defined around the circumference of the guide tube for returning the atomized solution from the atomizing solution reservoir to the one open end thereof. The atomizing box can contain a plurality of guide tubes each provided with a nozzle. The guide tube can also have a plurality of nozzles positioned therein.

Atomizer for forming a thin film

An apparatus featuring a suction head assembly for transferring a set of chips from a template assembly to a printed circuit board. In order to make the suction head assembly readily adaptable for mounting the chips in any of numerous different arrangements on circuit boards, a planar head carrier is provided which has a multiplicity of mounting holes formed therein in columns and rows. A set of suction heads can be mounted to the head carrier in any desired arrangement, corresponding to the desired chip arrangement on the circuit board, by having their holders removably engaged in selected ones of the array of mounting holes in the head carrier. The template assembly is likewise made adaptable for a variety of chip arrangements, by having a set of open-top positioning vessels removably engaged in selected ones of an array of mounting holes formed in a template.

Chip mounting apparatus

A method of mounting chips on a circuit board having a plurality of divided regions provided thereon comprising the steps of: forcibly delivering chips housed bulky in a housing container composed of a plurality of containers by delivering means to housing recesses provided on a template in positions corresponding to positions where the chips are mounted on the circuit board; moving a chip transfer means over the circuit board, the transferring means provided for transferring the chips housed in the housing recesses to the circuit board while the chips are held in same positions as they are delivered by the guide means; loading the circuit board on a base; and shifting the circuit board successively along multiple divided regions provided on the circuit board to the position of the housing recesses by means of a chip shifting means so that the chips can be mounted on the multiple divided regions. The apparatus for carrying out the method is disclosed.

Method of and apparatus for mounting chips

A mist supplying device for supplying a film-forming solution to form a thin film on a substrate includes a nozzle having an elongate outlet port, an atomizer coupled to the nozzle for atomizing the film-forming solution, and a disperser movably disposed in the nozzle between the outlet port and the atomizer and having a plurality of substantially uniformly distributed mist passages for passing the atomized film-forming solution in a first flow passage direction therethrough. An air blower is coupled to the atomizer for delivering the atomized film-forming solution into the nozzle. A driver unit is coupled to the disperser for reciprocally moving the mist passages in a second flow passage direction transverse to the first flow passage direction.

Mist supplying device for forming thin film

An apparatus for particular use in delivering leadless, tubular ceramic capacitors or like electronic components from a receptacle, containing a random pile of such components, to templates for the prearrangement of the components, preparatory to their attachment to printed circuit boards. The apparatus includes a vacuum pickup assembly for repeatedly picking up the components, at least one at a time, in the receptacle and depositing them on an entrance guide of approximately V-shaped cross section extending from an inclined, rotatable, tubular chute. The entrance guide functions to direct the components into the chute in alignment, for delivery to a desired location. After the pickup assembly deposits a component or components on the entrance guide each time, the entrance guide and the chute are bidirectionally rotated through a preassigned angle in each direction to facilitate the entrance of the component or components into the chute.

Growing community of inventors

Tokyo, Japan

Kikuji Fukai