Hitachi Chemical Company, Ltd.

Kiichi Kanamaru

Hisayoshi Mizugaki

Masahiko Ohta

Takao Michisaka

Keiji Hazama

Toshiyuki Arai

Mitsuru Hirao

Shinichi Ota

A beam scanning plane antenna is formed by stacking, in order, a system connecting portion, a Rotman lens portion, and a beam scanning antenna portion. The system connecting portion is formed by stacking, in order, a fourth grounding conductor, a sixth dielectric, a connecting substrate and a fifth dielectric. The Rotman lens portion is formed by stacking, in order, a third grounding conductor, a fourth dielectric, a Rotman lens substrate and a third dielectric. The beam scanning antenna portion is formed by stacking, in order, a second grounding conductor, a second dielectric, a power feeding substrate, a first dielectric and a first grounding conductor. A plurality of antenna groups that each include an irradiating element, a power feeding line and a first connecting portion, are formed on the power feeding substrate. The Rotman lens substrate includes a Rotman lens pattern, a second connecting portion and a third connecting portion.

Planar antenna for beam scanning

This triplate line interfacial connector electrically connects a first triplate line comprised of a first grounding conductor, first dielectric, first power feeding substrate, second dielectric and second grounding conductor, and a second triplate line comprised of a second grounding conductor, third dielectric, second power feeding substrate, fourth dielectric, and third grounding conductor. A patch pattern is formed at a connecting terminal portion of each power feeding line. Two shield spacers each having a through portion around the patch pattern are provided. A first slot is formed at a connecting position between the two triplate lines in the second grounding conductor.

Multi-layer line interfacial connector using shielded patch elements

A semiconductor package having a special cap shell wherein a flat molding having a window space with at least one level difference around the window space at the inside thereof is fitted with an ultraviolet-light transmissible lid at the level difference and an adhesive which has excellent sealing properties covers the periphery of the lid and the molding along and across the fitted portion so as to fix the lid to the molding without causing peeling of the adhesive.

Package structure for semiconductors

Growing community of inventors

Ibaraki-ken, Japan

Kiichi Kanamaru