Semes Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Sungkyunkwan University

Kihoon Choi

Hae-Won Choi

Jaeseong Lee

Chan Young Heo

Anton Koriakin

Do Heon Kim

Ki-Moon Kang

Ji Soo Jeong

Yoon Jong Ju

Daesung Kim

Kuntack Lee

Dongin Kim

Young-Hoo Kim

Sangjine Park

Jinkyu Kim

Jihoon Jeong

Jeong Ho Cho

Seohyun Kim

Jinkyu Park

Seong-Soo Kim

Byung Chul Kang

Hyeon Jun Lee

Kwangsup Kim

Sehoon Oh

Jaeyong Choi

Sanguk Son

Hyungseok Kang

Yerim Yeon

Donghwa Lee

Hyunseok Hong

In-Il Jung

Donghyuk Jang

Daigeon Yoon

Byung Man Kang

Youngran Ko

Yoon-Jong Ju

Myungjin Kim

Sang Ho Lee

Kwon Taek Lim

Jangmi Woo

Yong Hun Kim

Younghoon Jeong

Hong Gi Min

Keunhwa Yang

Yohan Lee

An apparatus for supplying chemical liquid may include at least two ink jet heads, a reservoir for receiving a chemical liquid provided onto a substrate from each of the at least two ink jet heads, a chemical liquid supplying member for providing the chemical liquid to each of the at least two ink jet heads, and a chemical liquid collecting member for drawing and collecting a chemical liquid remaining in each of the at least two ink jet heads. One path of the chemical liquid from the chemical liquid supplying member to the chemical liquid collecting member via one of the at least two ink jet heads may be substantially the same as a length of another path of the chemical liquid from the chemical liquid supplying member to the chemical liquid collecting member via the other of the at least two ink jet heads.

Apparatuses for supplying chemical liquid

A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

Substrate processing apparatus and substrate processing method

A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.

Substrate treating apparatus and substrate treating method

An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

Apparatus for treating substrate

An ink tank for a liquid chemical discharging apparatus configured to prevent equipment failure and improve durability by preventing scattering and backflow of a liquid chemical is described. The ink tank for a liquid chemical discharging apparatus includes: a liquid chemical receiving portion in which a liquid chemical is stored; a liquid chemical discharge port configured to supply the liquid chemical to an inkjet head; a pressure control port configured to control pressure of the liquid chemical receiving portion; and a partition wall provided in the liquid chemical receiving portion and configured to partition the liquid chemical receiving portion.

Ink tank for liquid chemical discharging apparatus and liquid chemical discharging apparatus including the same

Disclosed is a method of treating a substrate. In one embodiment, supercritical fluid is supplied to a treatment space in a chamber such that the substrate in the treatment space is treated. The supercritical fluid is supplied to the treatment space while exhausting the treatment space. A temperature of the supercritical fluid supplied when exhausting the treatment space is higher than a temperature of the supercritical fluid supplied to the treatment space for treating the substrate.

Method for treating substrate

A composition for cleaning a substrate is provided. According to an embodiment, the composition for cleaning the substrate includes an organic solvent having a Hansen solubility parameter of 5 or more to 12 or less for polystyrene latex to the substrate.

Substrate cleaning compositions, substrate cleaning method and substrate treating apparatus

An apparatus for processing a substrate includes a chamber having a processing space inside, a substrate support unit that supports the substrate in the processing space, and a temperature adjustment unit that is installed in the chamber and that adjusts temperature in the processing space. The temperature adjustment unit includes a heating member that heats the processing space and a cooling member that cools the processing space. The cooling member is located closer to a central axis of the chamber than the heating member.

Apparatus for processing substrate including cooling member closer to central axis than heating member

Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The anhydrous substrate cleaning composition includes an etching composite that provides fluorine, a solvent that dissolves the etching composite, and a binder that is a composite including phosphorous.

Substrate cleaning composition, substrate treating method, and substrate treating apparatus

Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a first process chamber configured to supply a development liquid to a substrate that is carried into the first process chamber after an exposure process is performed on the substrate, a second process chamber configured to treat the substrate through a supercritical fluid, a feeding robot configured to transfer the substrate from the first process chamber to the second process chamber, and a controller configured to control the feeding robot such that the substrate is transferred to the second process chamber in a state in which the development liquid supplied by the first process chamber resides in the substrate.

An apparatus for treating a substrate includes a developing chamber that performs a developing process on the substrate by supplying a developing solution, a supercritical chamber that treats the substrate by supplying a supercritical fluid, and a transfer chamber having a transfer unit that transfers the substrate W between the developing chamber and the supercritical chamber.

A substrate treating apparatus includes a treatment unit including a container, and a support member in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.

Inspection unit, inspection method, and substrate treating apparatus including the same

A display device includes: a display panel; a driving frequency converter circuit configured to convert a driving frequency according to an input image data. A common voltage controller outputs a common voltage data corresponding to the driving frequency; and a common voltage generator receives the common voltage data to generate a common voltage and outputs the common voltage to the display panel. The common voltage has an inclined waveform within an integer multiple of a frame period.

Display device having compensated common voltage

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior thereof, a spin head which supports and rotates the substrate inside the housing, and an ejection unit having a first nozzle member for ejecting a first treatment liquid onto the substrate positioned on the spin head. The first nozzle member includes a body having an ejection passage, through which the first treatment liquid flows, therein and a first discharge hole communicated with the ejection passage to eject the first treatment liquid onto the substrate, and a vibrator installed in the body to provide vibration for the first treatment liquid flowing through the ejection passage. The vibrator has an interference preventing recess for preventing an interference by reflective waves therein.

Substrate treating apparatus and treatment liquid nozzle

Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.

Method for treating a substrate with a shock wave

Growing community of inventors

Cheonan-si, South Korea

Kihoon Choi