Samsung Electronics Co., Ltd.

Kihan Kim

Yonghun Kim

ChangSik Yoo

Jaewoo Lee

Garam Choi

Donghun Lee

Hojun Chang

Jaewoo Jeong

Kiho Kim

Yongun Jeong

Donghyeok Jeong

Provided are a memory device and a method for training per-pin operation parameters. A memory device includes a plurality of on-die termination (ODT) circuits, an impedance control (ZQ) calibration circuit configured to output a first code signal and a second code signal, and a per-pin calibration circuit. The per-pin calibration circuit may be configured to select one signal pin from among the plurality of signal pins, to compare a first input voltage level of the selected signal pin with a second input voltage level of each of the other ones of the plurality of signal pins, to generate a per-pin ODT code signal for each of the plurality of signal pins, to combine the per-pin ODT code signal with the first code signal or the second code signal, and to provide the combined per-pin ODT code signal to the respective ODT circuits.

Memory device and method for training per-pin operation parameters

A semiconductor chip includes a write clock buffer, a voltage regulator, a process calibration circuit and a temperature calibration circuit. The voltage regulator generates plural regulated voltages. The process calibration circuit output one of the regulated voltages as a bias voltage of the write clock buffer, depending on a process variation of the semiconductor chip. The temperature calibration circuit track a temperature variation of the semiconductor chip in real time, performs analog calibration on the bias voltage from the process calibration circuit in real time depending on a result of the tracking, and outputs the analog-calibrated bias voltage to the write clock buffer.

Semiconductor chip capable of calibrating bias voltage supplied to write clock buffer regardless of process variation and temperature variation, and devices including the same

A memory device includes a multi-phase clock generator configured to generate first to N-th clock signals having N different phases based on a clock signal from the memory controller, and a monitoring clock signal generator configured to generate a monitoring clock signal having a logic state corresponding to a data pattern in synchronization with edges of the first to N-th clock signals, wherein the monitoring clock signal includes a first monitoring clock signal configured to detect a skew between the first and third clock signals in a first step of a training operation, a second monitoring clock signal configured to detect a skew between the second and fourth clock signals in a second step of the training operation, and a third monitoring clock signal configured to detect a skew between the first and second clock signals in a third step of the training operation.

Memory device adjusting skew of multi-phase clock signals, memory controller controlling the memory device, and operating method of the memory device

A semiconductor device includes: a clock generation circuit configured to output a plurality of clock signals that have different phases to a memory device, an internal clock signal of the memory device being generated responsive to the plurality of clock signals; and a training circuit configured to receive an output signal output based on the internal clock signal from the memory device, to adjust a value of a code used to generate the internal clock signal by adjusting the phase of at least one clock signal among the plurality of clock signals, to determine a final value of the code based on a duty cycle of the output signal, which is changed according to the adjustment of the value of the code, and to write the final value to the memory device.

Semiconductor device

Disclosed is a clock multiplexing circuit which includes a first transistor that is between a first input terminal that receives a first input clock signal and an output terminal that outputs an output pulse signal and operates based on a logic level of a second input terminal receiving a second input clock signal, and a second transistor that is between the output terminal and a first voltage node and operates based on the logic level of the second input terminal. The first input clock signal and the second input clock signal have the same period and have different phases. The output pulse signal transitions to a first logic level at a first time when the first input clock signal transitions to the first logic level and transitions to a second logic level at a second time when the second input clock signal transitions to the first logic level.

Clock multiplexing circuit

Disclosed are a memory device that performs offset calibration and a method of operating the memory device. The memory device includes an input/output pad configured to receive data from a device external, an on-die termination (ODT) circuit connected to the input/output pad, a plurality of receivers connected to the ODT circuit and configured to receive the data from the input/output pad, an offset calibration circuit configured to perform an offset calibration operation on data output from the plurality of receivers and output an offset correction, a first switch configured to provide a first voltage to the plurality of receivers, and a second switch configured to provide a second voltage to the plurality of receivers. During the offset calibration operation, the plurality of receivers receive a third voltage in response to the ODT circuit being enabled and the first voltage through the first switch.

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Suwon-si, South Korea

Kihan Kim