Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Sensor Technology Co., Ltd.

Kidong Han

Yue Li

Xue Cao

Yuelei Xiao

Yifan Wu

Wenbo Chang

Feng Qu

Yi Zhou

Yulin Feng

Qichang An

Lihui Wang

Biqi Li

Xuechao Song

Huiying Li

Yanfei Ren

Qiuxu Wei

Baijun Zhou

Lin Gong

A MEMS switch includes an insulating substrate, a driving electrode, a first insulating layer, a first surface of the insulating substrate is provided with a first region, the first region is closer to a surface of the insulating substrate away from the first surface, relative to the first surface, and the driving electrode is on the first region; the first insulating layer completely covers the driving electrode; the first signal transmission line is on a surface of the first insulating layer away from the insulating substrate; and the second signal transmission line includes a signal transmission segment and a cantilever segment connected together as a one-piece member, the signal transmission segment is on the first surface of the insulating substrate, and the cantilever segment is suspended on a side of the first signal transmission line away from the insulating substrate.

MEMS switch and method of manufacturing the same

A sensing substrate and a manufacturing method thereof are provided. The sensing substrate includes a base substrate, a heat electrode and a strain detection electrode which are disposed on the base substrate, and an insulation layer covering the heat electrode and the strain detection electrode. The heat electrode is configured for heating, and the strain detection electrode is configured to detect strain. The heat electrode and the strain detection electrode each have a metal mesh structure.

Sensing substrate, manufacturing method therefor and electronic apparatus

A filter circuit includes a first resonant sub-circuit, a second resonant sub-circuit and an impedance matching network; the first resonant sub-circuit and the second resonant sub-circuit are each connected to the impedance matching network in series; the first resonant sub-circuit is configured to allow a signal with a frequency higher than a first frequency to pass; the second resonant sub-circuit is configured to allow a signal with a frequency lower than a second frequency to pass, and the second frequency is greater than the first frequency; the impedance matching network is configured to allow a signal between the first frequency and the second frequency to pass; the impedance matching network includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor and a first inductor.

Filter circuit, filter, method of manufacturing filter, and electronic device

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Beijing, China

Kidong Han