Asm IP Holding B.v.

KiChul Um

YongGyu Han

JeungHoon Han

DooHan Kim

WanGyu Lim

TaeHee Yoo

DongHyun Ko

Sangjean Jeon

Doohan Kim

SangYeop Lee

A substrate processing apparatus capable of removing signal interference between reactors includes: a first reactor, a second reactor adjacent to the first reactor, and a power generator configured to supply first power to the first reactor and supply second power to the second reactor, wherein the power generator is further configured to synchronize phases of the first power and the second power.

Substrate processing apparatus

A substrate support unit for thin film deposition on a substrate including a pattern structure and a thin film deposition apparatus including the substrate support unit includes a heater; an RF electrode; a first rod connected to the heater; a second rod connected to the RF electrode; and an RF shield spaced apart from the second rod, disposed to surround the second rod, and extending in an extension direction of the second rod.

Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same

A thin film deposition method with respect to a substrate including a pattern structure includes supplying RF power through a component disposed below a substrate, forming a potential on an exposed surface of the substrate exposed to a reaction space, moving the active species to the exposed surface in the reaction space using the potential, and forming a thin film including active species component on the exposed surface of the substrate.

Thin film deposition method

Growing community of inventors

Osan-si, South Korea

KiChul Um