Samsung Electronics Co., Ltd.

Seoul National University

Kibum Kim

Hyeonjin Shin

Sanghun Lee

Keunwook Shin

Seongjun Park

Hyunjae Song

Minhyun Lee

Yunho Kang

Hyunmi Kim

Jinsu Kim

Kyung-Eun Byun

Changseok Lee

Seokjoon Park

Hakjoon Kim

The electronic device may include: a housing; a printed circuit board (PCB) disposed in the housing, the PCB including a first board surface facing a first direction and a second board surface opposite to the first board surface, and having an opening penetrating through a surface thereof, a sound module disposed in the opening so that a front thereof faces the first direction, and electrically connected to the PCB to generate a sound, a shield can connected to the second board surface to cover the opening, in a state in which the second board surface is viewed, and a frame disposed to face the first board surface.

Electronic device including speaker

Provided are a wiring including a graphene layer and a method of manufacturing the wiring. The method may include growing a graphene layer on a substrate and doping the graphene layer with a metal. The graphene layer may be grown using a plasma of a hydrocarbon at a temperature of about 200° C. to about 600° C. by plasma enhanced chemical vapor deposition (PECVD).

Wiring including graphene layer and method of manufacturing the same

An interconnect structure may include a graphene-metal barrier on a substrate and a conductive layer on the graphene-metal barrier. The graphene-metal barrier may include a plurality of graphene layers and metal particles on grain boundaries of each graphene layer between the plurality of graphene layers. The metal particles may be formed at a ratio of 1 atom % to 10 atom % with respect to carbon of the plurality of graphene layers.

Interconnect structure including graphene-metal barrier and method of manufacturing the same

According to various embodiment of the present invention, an electronic device comprises: an audio module including a speaker and a receiver; a codec circuit for transmitting and receiving an audio signal; a magnetic secure transmission (MST) circuit; a switch unit; a memory; and a processor electrically connected with the audio module, the codec circuit, the MST circuit, the switch unit, and the memory, wherein, if a function for requesting a payment is executed when the codec circuit and the audio module are connected with each other, the processor can be configured to: control the switch unit so as to connect the MST circuit with the speaker and/or the receiver, which are included in the audio module; and transmit the MST signal for the payment by using the speaker and/or the receiver, which are connected with the MST circuit. In addition to various embodiments disclosed in the present invention, other various embodiments are possible.

Electronic device and method for making payment by using audio module

A nonvolatile memory apparatus includes a first electrode, a second electrode separated from the first electrode, a resistive-change material layer provided between the first electrode and the second electrode and configured to store information due to a resistance change caused by an electrical signal applied through the first electrode and the second electrode, and a diffusion prevention layer provided between the first electrode and the resistive-change material layer and/or between the second electrode and the resistive-change material layer and including a two-dimensional (2D) material having a monolayer thickness of about 0.35 nm or less.

Nonvolatile memory apparatus including resistive-change material layer

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Seoul, South Korea

Kibum Kim