Freescale Semiconductor,inc.

Kian Leong Chin

Kevin John Hess

Chu-Chung Lee

Tu-Anh N Tran

Heng Keong Yip

James Patrick Johnston

Patrick Johnston

An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.

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Kuala Lumpur, Malaysia

Kian Leong Chin