Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies General IP (singapore) Pte. Ltd.

Kiam Soon Ong

Kheng Leng Tan

Keat Chuan Ng

Chiau Jin Lee

Aizar Abdul Karim Norfidathul

Abdul Karim Norfidathul Aizar

In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Semiconductor device with an interlocking wire bond

In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Semiconductor device with an interlocking structure

A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.

Multi-chip packaged LED light source

An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die.

Growing community of inventors

Penang, Malaysia

Kiam Soon Ong