Amkor Technology, Inc.

Skyworks Solutions, Inc.

Lg Electronics Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Pacific Corporation

Ki Wook Lee

Jae Dong Kim

Robert Francis Darveaux

Miguel Angel Jimarez

Ju Hoon Yoon

Dae Keun Park

Michael Barrow

Kwang Sik Kim

Ha Min Song

Jin Seong Kim

Ho Sam Choi

Dong Joo Park

Dae Byoung Kang

Kwang Ho Kim

Sung Hwan Cho

Byeong G Lee

Dong I Chang

Jong Y Hong

Chang M Yang

Yeon Soo Jung

Anthony James Lobianco

Hoang Mong Nguyen

Michael G Kelly

Dinhphuoc Vu Hoang

Russ Alan Reisner

Hardik Bhupendra Modi

Min Jae Lee

Stephen Joseph Kovacic

Han Su Jung

Min Kyun Yoo

Lori Ann DeOrio

Foad Arfaei Malekzadeh

John C Baldwin

Sang Jae Jang

Takeshi Furusawa

Sundeep Nand Nangalia

René Rodriguez

Chang Ho Jang

Disclosed are a motor control apparatus and a motor control method. Specifically, the motor control apparatus includes an inverter part configured to convert a direct current (DC) input into an alternating current (AC) output and provide the AC output to the motor, and a controller configured to control the inverter part in relation to driving of the motor, and the controller controls the inverter part to apply a first pattern voltage having the same phase to the motor and then apply a second pattern voltage having different phases to the motor.

Apparatus for controlling motor and method for controlling motor

In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. Other embodiments of the semiconductor device comprise one or more interposers which are electrically connected to the through-mold vias, and may be covered by the package body and/or disposed in spaced relation thereto. In yet other embodiments of the semiconductor device, the interposer may not be electrically connected to the through mold vias, but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.

Semiconductor device with through-mold via

Disclosed is a motor control apparatus and a motor control method to estimate a stator resistance of a motor for sensorless control of the motor.

Disclosed is a motor control apparatus, a motor control system, and a motor control method that estimate a stator resistance and a rotor position for sensorless control of a motor.

Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Devices and methods related to nested filters

Disclosed is a motor control apparatus including an inverter part configured to convert DC power into AC power and provide the AC power to a motor, and a controller configured to control driving of the motor by using the inverter part, the controller configured to identify a stop position of a rotor in previous driving of the motor, and control the inverter part to apply an input signal of a specific pattern to the motor according to a start of driving the motor, wherein a phase of the input signal of the specific pattern is determined on the basis of the stop position of the rotor. Other example embodiments may be provided.

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Method of making a closed cavity printed circuit board with patterned laminate structure

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

Printed circuit board structure including a closed cavity

Method of making printed circuit board structure including a closed cavity with vias

A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.

Method of manufacturing a radio-frequency module with a conformal shield antenna

Method of making printed circuit board structure including a closed cavity

An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Exposed die overmolded flip chip package and fabrication method

An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a apace between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surfaces, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Growing community of inventors

Seoul, South Korea

Ki Wook Lee