Samsung Electronics Co., Ltd.

Duk San Neolux Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Samsung Display Co., Ltd.

Tokai Carbon Korea Co., Ltd

Other

Lg Philips Lcd Co., Inc.

Ki Won Kim

Soung Yun Mun

Sang Soo Park

Jae Min Lee

Woo Chul Shin

Sung Jun Lee

Dong Hwi Shin

Yeon Hee Choi

Jung Cheol Park

Mun Jae Lee

Chae Min Park

Ji Hee Moon

Kwan Hee Lee

Ji Min Kim

Eun Young Kim

Byoung-Hee Lee

Sun Young Lee

Dong Kyu Lee

Joon Gu Lee

Yeon Hwa Lee

Hyung Dong Lee

Jung Eun Han

Sun Pil Hwang

Mi Kyung Kim

Jung Geun Lee

Jun Tai Kim

Jae Duk Yoo

Chan Won Lee

Joo Namkung

Bu Yong Yun

Ja Min Goo

Si Hak Jang

Hyung Woo Kim

Yong Ju Yu

Nam Jin Park

Sae Gee Oh

Jin Woo Shin

Chul Kwi Kim

Jun Ik Lee

Im Sung Lee

Jang Hoon Kang

Joon Rae Cho

Ki Young Kwon

Tae Eon Kim

Ji Hyun Seo

Kyung Hwan Oh

Seong Hoon You

Jae Woo Park

Jong Hyun Kim

Jung Wook Lee

Ji Hyun Park

Sang Hoon Kim

Kap Soo Yoon

Min Jung Kim

Seung Jin Kim

Won Jun Hwang

Byoung Hee Lee

Ho Chul Hwang

Han Seong Jung

Young Joo Choi

Ah Reum Kim

Sang Wook Ahn

Sung Hoon Kim

Jae Ho Hwang

Jeong Jin Lee

Won Pyo Hong

Chang Tae Kim

Jin Man Kim

Joung Il Kim

Young Mok Kim

Yun Seok Choe

Je Heon Park

Yeo Jin Kim

Sang Woo Bae

Hye Young Ryu

Hee Sun Yun

Yu Bi Han

Ji Hea Kim

Han Eol Cho

Kyung Mi Kim

Hee Jun Ryu

Hye Lin Lee

Jong Sung Yun

Il Jun Kang

Hyung Joo Suh

Young Chun Choi

Chang Shik Yoon

Il Joo Chae

Hyeong Uk Roh

Sung Bin Hong

Namjin Park

Bum Chul Bae

Seung Ho Kang

A semiconductor memory device including a memory cell array and a peripheral circuit element configured to control an operation of the memory cell array, and a wiring structure including first and second wiring structures spaced apart from each other on the peripheral circuit element, a first voltage and a second voltage different from the first voltage applied to two opposite ends of the first wiring structure, respectively, and a third voltage different from the first and second voltages applied to the second wiring structure, may be provided. The first wiring structure includes first lines extended in a first direction and spaced apart from each other in a second direction crossing the first direction, the second wiring structure includes second lines extended in the first direction and spaced apart from each other in the second direction, and one of the first lines is between the second lines.

Semiconductor memory device

Provided are a compound capable of lowering a driving voltage, enhancing light emitting efficiency and thermal resistance, and improving lifespan and color purity of the element, an organic element using the same, and an electric device for the same.

Compound for organic electric element, organic electric element comprising the same, and electronic device thereof

Provided are a fluorinated compound for patterning a metal or an electrode (cathode), an organic electronic element using the same, and an electronic device thereof, wherein a fine pattern of the electrode is formed by using the fluorinated compound as a material for patterning a metal or an electrode (cathode), without using a shadow mask, and it is possible to more easily apply UDC since it is easy to manufacture a transparent display having high light transmittance.

Compound for organic electronic element, organic electronic element using the same, and an electronic device thereof

The present invention relates to semiconductor manufacturing parts used in a dry etching process. Semiconductor manufacturing parts comprising a SiC deposition layer, of the present invention, comprises: a base material; and a SiC deposition layer formed on the surface of the base material, wherein the thickness ratio of the base material and the SiC deposition layer is 2:1 to 100:1.

Semiconductor manufacturing parts comprising SiC deposition layer, and manufacturing method therefor

An electronic device and method are disclosed herein. The electronic device includes a microphone, a camera, an output device, a memory, and a processor. The processor implements the method, including receiving a voice input and/or capturing an image, and analyze the first voice input or the image to determine at least one of a user's intent, emotion, and situation based on predefined keywords and expressions, identifying a category based on the input, selecting first information based on the category, selecting and outputting a first query prompting confirmation of output of the first information, detect a first responsive input to the first query, and when a condition to output the first information is satisfied, output a second query, detecting a second input responsive to the second query, and selectively outputting the first information based on the second input.

Provision of targeted advertisements based on user intent, emotion and context

Provided are a compound represented by Formula 1, and an organic electric element comprising a first electrode, a second electrode, and an organic material layer formed between the first electrode and the second electrode, wherein the organic material layer comprised the compound represented by Formula 1, and the driving voltage of an organic electronic device can be lowered, and the luminous efficiency, color purity and life time of an organic electronic device can be improved by comprising the compound represented by Formula 1 in the organic material layer.

Compound for organic electric element, organic electric element comprising the same and electronic device thereof

The present invention relates to a method for manufacturing semiconductor manufacturing parts used in a dry etching process, and a jig usable therein, and the method for manufacturing semiconductor manufacturing parts by using the jig, of the present invention, comprises the steps of: preparing a base material; supporting at least one surface of the base material by the jig; forming a deposition layer by spraying source gas on the base material supported by the jig; and processing the base material on which the deposition layer is formed, wherein the jig has a tapered cross-section of which the width increases in the direction of approaching the surface of the base material.

Method and apparatus for manufacturing semiconductor manufacturing parts by using jig

Compound for organic electric element, organic electric element using same, and electronic apparatus thereof

An electronic device according to an embodiment may comprise: a speaker, an amplifier connected to the speaker through a first electrical path; and at least one processor electrically connected to the amplifier, wherein the at least one processor is configured to: provide a first audio signal set to a first volume level to the speaker via the amplifier; when the first volume level is less than a predetermined first value, output the first audio signal at the first volume level through the speaker; and when the first volume level is equal to or greater than the first value, control a volume level of the first audio signal on the basis of a temperature value of the speaker, which is estimated from the first audio signal.

Electronic device comprising speaker

An electronic device according to an embodiment disclosed in the present specification may comprise a processor, a touch panel for receiving a touch input, a pressure sensor for detecting a pressure value of the touch input, and a controller for transmitting to the processor touch data corresponding to the touch input. The controller responds to the touch input if the pressure value of the touch input is a threshold value or greater, switches an operation mode of the controller from a first mode to a second mode, and can transmit the touch data to the processor in the second mode. Besides this, various embodiments are possible as identified in the specification.

Touch recognition method and electronic device executing same

A method for controlling a touch screen is provided. The method includes detecting a touch input by an external object through the touch screen; monitoring the touch input; changing a touch report rate from a first frequency to a second frequency; and reporting information of the touch input to a processor at the touch report rate while the touch input is maintained.

Method for controlling touch screen and electronic device supporting thereof

An electronic device is provided. The electronic device includes a touch input device, a touch control circuit configured to generate touch information about a touch input detected by the touch input device, at least one processor, and a memory. The memory stores instructions, when executed, causing the at least one processor to obtain touch information about a first touch input at least once from the touch control circuit after a first time when the first touch input begins to a second time when the first touch input is released, obtain at least one of an area of the first touch input or a pressure of the first touch input based on the obtained touch information, and execute a function corresponding to release of the first touch input if the at least one of the area of the first touch input or the pressure of the first touch input meets a specified condition.

Touch input processing method and electronic device for supporting the same

A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with the respective dielectric layers disposed therebetween, and first and second external electrodes disposed on first and second external surfaces of the ceramic body to be connected to corresponding internal electrodes, respectively. A longest distance from the first external electrode to the second external electrode is denoted by La, a shortest distance from the first external electrode to the second external electrode is denoted by Lb, and Lb/La is greater than zero to 0.6 or less.

Multilayer ceramic electronic component

A method and apparatus for reproducing a component of a semiconductor manufacturing apparatus, and a reproduced component are provided. The method may include a preparing step of preparing a damaged component of a semiconductor manufacturing apparatus, a first cleaning step of cleaning the damaged component, a masking step of masking at least one of areas including an undamaged part of the damaged component, a reproduced part forming step of forming a reproduced part on the damaged component using a chemical vapor deposition (CVD), a post-grinding step of grinding the damaged component with the reproduced part, and a second cleaning step of cleaning the damaged component with the reproduced part.

Method and apparatus for reproducing component of semiconductor manufacturing apparatus, and reproduced component

Growing community of inventors

Suwon-si, South Korea

Ki Won Kim