Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Ki Won Choi

Seung Woo Lee

Sun Ki Kim

Seung H Ahn

Sung Min Jang

Kyung Pil Nam

Yoo Sam Na

Seung Min Oh

Do Soo Jeong

Hyeon J Jeong

Hyo Seok Kwon

Min Cheol An

Seung Kon Mok

Yeon Woo Lee

There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit generating an induced current according to a change in a current applied to the light emitting diode, a main switch controlling power applied to the LED string according to an on/off switching operation, and a capacitor charged with a voltage of the power applied to the LED string when the main switch is switched on and applying the charged voltage to the LED string when the main switch is switched off.

Light source apparatus and light emitting diode package

There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit for generating an induced current according to a change in a current applied to the light emitting diode. A main switch controls power applied to the LED string according to an on/off switching operation A capacitor is charged with a voltage of the power applied to the LED string when the main switch is switched on, and applies the charged voltage to the LED string when the main switch is switched off.

A light source assembly includes a plurality of light source modules detachably connected to one another. Each light source module includes a frame part, an electrical connection part, and at least one light emitting device. The frame part includes a female coupling disposed in one side surface thereof and a male coupling disposed on another side surface thereof and configured to be engaged with a female coupling of another light source module of the plurality. The electrical connection part is disposed on an upper surface of the frame part and extends onto the one side surface having the female coupling disposed therein and onto the other side surface having the female coupling disposed thereon. The at least one light emitting device is mounted on the electrical connection part and disposed on the upper surface of the frame part.

Light source assembly formed of a plurality of light source modules detachably connected together

A linear channel select filter for an Intermediate Frequency selector of a satellite broadcasting tuner, linearly changes a desired frequency by adjusting an output current, and includes: a transconductance (GM) current cell controller for determining a control voltage according to a select signal, generating the output current according to an differential input voltage, linearly controlling the output current according to the control voltage, and providing a linearly variable resistance according to the linearly controlled output current, and a capacitor circuit coupled to the GM cell controller to provide a capacitance to generate a cutoff frequency voltage according to the output current and the variable resistance. An occupying area and a size of the filter are reduced.

Linear channel select filter

A three dimensional stack package device that can realize vertical electrical interconnection of the stacked individual package devices without a cost increase or additional complicated processing steps. The three dimensional package device includes a plurality of individual semiconductor devices, each individual semiconductor device including (1) a semiconductor chip, (2) a protective body for encapsulating the semiconductor chip, (3) a lead frame comprising inner lead portions electrically interconnected to the semiconductor chip and included within the protective body, outer lead portions formed as a single body with the inner lead portions, and coupling lead portions located between the inner and outer lead portions and having a top surface exposed upward from the protective body, and (4) a plurality of vertical interconnection elements attached to a back surface of the coupling lead portions and exposed from the protective body in a direction opposing the exposed top surface of the coupling lead portions, whereby, an electrical interconnection of the plurality of individual semiconductor devices is accomplished by the coupling lead portions and the vertical interconnection elements, and electrical interconnection of the three dimensional stack package device to an external circuit device is accomplished by the outer lead portions of a lowermost semiconductor device.

Three dimensional stack package device having exposed coupling lead

A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to the bonding pads through wires, and chips attached to upper and lower surfaces of the substrate. A paddles lead frame is provided onto which the individual packages are attached to upper and lower surfaces thereof, and variants thereof. For these packages, since individual packages are mounted on upper and lower surfaces of a single printed circuit board or lead frame, the mounting density can be significantly increased and their production can be simplified.

Growing community of inventors

Gyeonggi-do, South Korea

Ki Won Choi