Samsung Electronics Co., Ltd.

Ki-Whan Song

Jin-Young Kim

Duk-Ha Park

Nam-Kyun Tak

Yeong-taek Lee

Byung-Gook Park

Chang-Woo Oh

Chang-Hyun Kim

Bong-Soon Lim

Seong-Jin Kim

Su-Chang Jeon

June-Hong Park

Dong-kyo Shim

Chang-Yeon Yu

Hoon Jeong

Woo-Yeong Cho

Chul-woo Park

Jung-bae Lee

Hoe-Ju Chung

Dong-jin Lee

Sang-Hyun Joo

Il-Han Park

Kyung-Ryun Kim

Chan-jong Park

Ho-Sung Song

Su-a Kim

Sang-Yong Yoon

Duk-Min Kwon

Jong-Duk Lee

Myoung-gon Kang

Su-A Kim

Dong-su Lee

Chang-hyun Kim

Chang-kyun Kim

A nonvolatile memory device including a memory cell array having a plurality of planes; a plurality of page buffers arranged corresponding to each of the plurality of planes; and a control logic circuit configured to transmit a bit line setup signal to each of the plurality of page buffers. Each of the plurality of page buffers includes a precharge circuit configured to precharge a sensing node and a bit line in response to the bit line setup signal, and a shutoff circuit configured to perform a bit line shutoff operation in response to a bit line shutoff signal. The control logic circuit is configured to control a transition time when a level of the bit line setup signal is changed according to a gradient of the bit line shutoff signal which is changed from a first level to a second level.

Nonvolatile memory device

A method of operating a data storage device includes providing a memory cell array that includes a first word line, a second word line and a buffer configured to store second data to be programmed into the second word line, reading the second data from the buffer, and programming first data into the first word line. A programming condition of the first data being is changed based on the second data read from the buffer.

Data storage system and method of operating data storage system

A nonvolatile memory device comprises a nonvolatile memory chip comprising a static latch, first and second dynamic latches that receive the data stored in the static latch through a floating node, and a memory cell configured to store multi-bit data. The nonvolatile memory device performs a refresh operation on the first dynamic latch where externally supplied first single bit data is stored in the first dynamic latch, performs a refresh operation on the second dynamic latch where externally supplied second single bit data is stored in the second dynamic latch, and programs the memory cell using the data stored in the first and second dynamic latches after the first and second single bit data are stored in the respective first and second dynamic latches.

Nonvolatile memory device and related method of operation

A voltage generator comprises a first booster that generates a first high voltage, and a second booster that generates a second high voltage by boosting an external voltage. The first booster comprises a comparator that controls a boosting operation with reference to the fed back first high voltage and uses the second high voltage as a drive voltage.

Voltage generator, nonvolatile memory device comprising voltage generator, and method of operating voltage generator

Transistors, semiconductor memory cells having a transistor and methods of forming the same are provided, the transistors may include a semiconductor substrate having a first semiconductor region. A gate pattern may be disposed on the first semiconductor region. Spacer patterns may each be disposed on a sidewall of the gate pattern. Second semiconductor regions and a third semiconductor regions may be disposed in the semiconductor substrate. The second semiconductor regions may be disposed under the spacer patterns. The third semiconductor regions may be disposed adjacent to the second semiconductor regions. The first semiconductor region may have a higher impurity ion concentration than the second semiconductor regions.

Transistors, semiconductor memory cells having a transistor and methods of forming the same

A nonvolatile semiconductor memory device includes a plurality of pillars protruding upward from a semiconductor substrate and having respective top surfaces and opposing sidewalls, a bit line on the top surfaces of the pillars and connecting a row of the pillars along a first direction, a pair of word lines on the opposing sidewalls of one of the plurality of pillars and crossing beneath the bit line, and a pair of memory layers interposed between respective ones of the pair of word lines and the one of the plurality of pillars. Methods of fabricating a nonvolatile semiconductor memory device include selectively etching a semiconductor substrate to form pluralities of stripes having opposing sidewalls and being arranged along a direction, forming memory layers and word lines along the sidewalls of the stripes selectively etching the stripes to form a plurality of pillars, and forming a bit line connecting the pillars and crossing above the word lines.

Nonvolatile semiconductor memory devices

A nonvolatile memory device includes: a memory array including a plurality of memory banks which are arranged in a first direction; a write global bit line and a read global bit line extending in the first direction to be shared by the memory banks; a write circuit connected to the write global bit line and disposed on a first side of the memory array; and a read circuit connected to the read global bit line and disposed on a second side of the memory array opposite the first side of the memory array, wherein each of the memory banks extends in a second direction different from the first direction and comprises a plurality of nonvolatile memory cells, each of the nonvolatile memory cells having a variable resistive element whose resistance value varies according to data stored therein.

Nonvolatile memory device using resistance material and memory system including the nonvolatile memory device

A semiconductor device includes a first substrate including at least one first well region and first impurity regions on portions of the substrate and a bias voltage plate on a surface of the substrate. A semiconductor device may be of a three dimensional stack structure, and in example embodiments, the semiconductor device may further include a through contact plug substantially perpendicularly penetrating at least one substrate and at least one bias voltage plate. Therefore, a design margin of a semiconductor device may be enhanced and a bias voltage may be provided reliably.

Semiconductor device and semiconductor package including the same

The semiconductor memory device includes a first memory cell array including at least one first memory cell and at least one second memory cell corresponding to the at least one first memory cell, a first low bit line connected to the at least one first memory cell, a first low complementary bit line connected to the at least one second memory cell, a first switch unit having a first terminal connected to the first low bit line, a second switch unit having a first terminal connected to the first low complementary bit line, a first global bit line connected to a second terminal of the first switch unit, a first global complementary bit line connected to a second terminal of the second switch unit, and a plurality of sensing amplifying units connected to the first global bit line and the first global complementary bit line.

Semiconductor memory device having hierarchical bit line structure and method of driving the semiconductor memory device

A semiconductor memory device including a transistor having a vertical channel structure is provided. The device includes a first sub memory cell array including a first memory cell connected to a first bit lines and including a transistor having a vertical channel structure, a second sub memory cell array including a second memory cell connected to a first inverted bit lines and including a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.

Semiconductor memory device comprising transistor having vertical channel structure

A redundancy circuit includes at least one fuse set circuit and a fuse control circuit. The at least one fuse set circuit includes a plurality of fuse cells, each of the plurality of fuse cells having a first transistor and a second transistor having same sizes. The first transistor has a first contact resistance and the second transistor has a second contact resistance different from the first contact resistance. Each of the plurality of fuse cells stores a fuse address indicating a defective cell in a repair operation and outputs a repair address corresponding to the stored fuse address. The fuse control circuit, connected to the plurality of fuse cells, controls the plurality of fuse cells in response to a program signal and a precharge signal such that the corresponding fuse address is stored in each of the fuse cells.

Redundancy circuits and semiconductor memory devices

A semiconductor memory device having the mismatch cell makes a capacitance difference between a bit line pair relatively large during a read operation using at least one dummy memory cell as a mismatch cell selected together with a corresponding memory cell. Therefore, data of a semiconductor memory device may be detected more easily.

Semiconductor memory devices with mismatch cells

Antifuses and program circuits having the same. The antifuses are embodied as a transistor. When a first power supply voltage is applied to a source, a first program voltage for causing impact ionization is applied to a gate and drain, and a second program voltage for causing channel initiated secondary electron/channel initiated secondary hole (CHISEL/CHISHL) is applied to a well, a dielectric material may be ruptured between the gate adjacent to the drain and the well so that an antifuse may be programmed.

Antifuses and program circuits having the same

Semiconductor memory devices with a memory cell array including a first word line and a second word line arranged in a first direction, a source line arranged in the first direction between the first word line and the second word line, a bit line pair including a first bit line and a second bit line arranged in a second direction perpendicular to the first direction, a first memory cell including a gate connected to the first word line and first and second regions respectively connected to the second bit line and the source line, and arranged in a third direction between the first direction and the second direction, and a second memory cell including a gate connected to the second word line, a third region and the second region respectively connected to the first bit line and the source line, and arranged in the third direction.

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Seoul, South Korea

Ki-Whan Song