Samsung Electro-mechanics Co., Ltd.

Ami Pharm Co., Ltd.

Ki Taek Lee

Jin Won Choi

Sung Won Jeong

Hueng Jae Oh

Gi Sub Lee

Heung Jae Oh

Yong Ho Baek

Dong Gyu Lee

Seok Hyun Park

Seung Jean Moon

The present invention relates to a composition comprising glycocholic acid or taurocholic acid and phosphatidylcholine at a particular mixing ratio for reducing localized fat without side effects such as a pain, edema, necrosis of muscle cells, fibroblasts and vascular endothelial cells other than adipocytes, anesthesia of administration sites, extensive swelling, erythema, induration, paresthesia, nodule, pruritus, burning sensation, nerve injury, and dysphagia, and a method for preparing the same. The inventor has found that the effect of PPC injectable composition on fat reduction may be reduced or enhanced during its subcutaneous administration, depending on the types of solubilizing agents, especially the types of bile acids, which are combined so as to prepare a safe and stable PPC injection using insoluble PPC. The PPC injectable composition solubilized with GCA or TCA selectively reduces adipocytes without inducing necrosis of fibroblasts, muscle cells and vascular endothelial cells, thereby alleviating the known clinical side effects.

Injectable composition for localized fat reduction without pain, edema, and side effects, and method for preparing same

A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Lead pin for package substrate

Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.

Lead pin for printed circuit board and printed circuit board using the same

There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.

Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate.

Lead pin for package substrate, and method for manufacturing package substrate with the same

Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Growing community of inventors

Seoul, South Korea

Ki Taek Lee