Lg Innotek Co., Ltd.

Iron Device Corporation

Ki Tae Park

Jun Young Lim

Dae Sung Yoo

Tae Ki Hong

Han Mo Koo

Sang Ki Cho

Jae Sung Jo

Nak Ho Song

Joo Chul Kim

Dong Guk Jo

Jin Sung Kim

Dong Chan Kim

Eon Jong Lee

Hyun Min Cho

Jae Wook Lee

Chae Won Kang

Hwang Soo Son

Man Ki Son

Kyu Don Choi

Eu Ho Chong

Disclosed herein is provided an electronic device for operating a resonator element at a resonance frequency, the electronic device includes: a control unit configured to control driving of the resonator element connected to an output terminal of an amplifier unit in a manner in which a drive signal is acquired according to a first clock signal and input to the amplifier unit; a phase difference detection unit configured to detect a phase difference between a voltage and a current at the output terminal of the amplifier unit; and a frequency variation unit configured to vary a frequency of the first clock signal based on the phase difference detected by the phase difference detection unit, to converge an operating frequency of the resonator element to the resonance frequency.

Electronic device and method for operating resonator element at resonance frequency

A power source apparatus, according to an aspect of the present disclosure, includes: a circuit on a primary side constituted so that a first voltage with an input voltage stepped down is formed on the primary side of a transformer; and a circuit on a secondary side including first to N sub-circuits (N is a natural number of 2 or more), each sub-circuit operating to generate a power source voltage of a driver configured to drive a power element through a converter operating based on a second voltage formed on the secondary side of the transformer after the first voltage is transformed by the transformer, in which the power source voltage generated by the sub-circuit is determined dependently on an output voltage of the converter.

Power apparatus

A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the chip mounting region and including a third wiring portion connecting the third pad portion and an extension wiring portion that extends to the outside of the third pad portion, and a protective layer is disposed on the first wiring portion and the second wiring portion.

Flexible printed circuit board, COF module, and electronic device comprising the same

A flexible printed circuit board according to an embodiment includes: a substrate; a circuit pattern disposed on the substrate; and a protective layer on the circuit pattern, wherein the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip in a chip mounting region, a first direction that is a direction in which the circuit pattern extends and a second direction perpendicular to the first direction are defined in the substrate, the substrate includes first and second ends facing each other in the first direction and third and fourth ends facing each other in the second direction, the protective layer includes fifth and sixth ends spaced apart from ends of the substrate and facing in the first direction and seventh and eighth ends spaced apart from ends of the substrate and facing in the second direction, and an outer pattern disposed adjacent to the third end and the fourth end on the substrate, wherein the outer pattern includes: a first outer pattern and a second outer pattern adjacent to a pad portion of the first circuit pattern and facing in the second direction; and a third outer pattern and a fourth outer pattern adjacent to a pad portion of the second circuit pattern and facing in the second direction, the first outer pattern includes a first pattern portion and a second pattern portion spaced apart from each other, the second outer pattern includes a third pattern portion and a fourth pattern portion spaced apart from each other, the third outer pattern includes a fifth pattern portion and a sixth pattern portion spaced apart from each other, the fourth outer pattern includes a seventh pattern portion and an eighth pattern portion spaced apart from each other, and a fifth end of the protective layer is disposed between the first pattern portion and the second pattern portion and between the third pattern portion and the fourth pattern portion.

The present invention relates to a speaker driver and an operation method thereof and includes an amp part configured to output a pulse voltage, in which an input signal is amplified on the basis of a supply voltage, to drive a capacitive speaker that generates sound by a driving voltage so that the driving voltage formed by filtering the pulse voltage is applied to the capacitive speaker, and a controller configured to adjust a magnitude of an input audio signal in a high frequency range and transmit the input audio signal to the amp part as the input signal to limit an overcurrent applied to the capacitive speaker by the driving voltage having a high frequency.

Speaker driver and operation method thereof

The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Method of manufacturing a carrier tape

Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.

Tape for electronic devices with reinforced lead crack

The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Carrier tape for tab-package and manufacturing method thereof

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Growing community of inventors

Seoul, South Korea

Ki Tae Park