Ntrium Inc.

Ki Su Joo

Ju Young Lee

Se Young Jeong

Jin Ho Yoon

Jeong Woo Hwang

Se Young Jung

Kyu Jae Lee

Jung Woo Hwang

Yoon Hyun Kim

Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

Electronic component package for electromagnetic interference shielding and method for manufacturing the same

Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.

Electronic device having electromagnetic interference shielding layer and method of manufacturing the same

Growing community of inventors

Suwon, South Korea

Ki Su Joo