Samsung Electronics Co., Ltd.

Ki-Soo Park

Oh-Dal Kwon

Gi-Tae Mun

Hae-Young Lee

Young-Soo Yang

Dae-Hyun Kang

Soung-Il Kim

Sang-Bae Kim

Disclosed is a device for aligning an optical source and an optical fiber in an optical source module. The optical source module has a substrate, an optical source mounted on the substrate, an optical fiber for receiving lights emitted by the optical source, an optical fiber ferrule for supporting the optical fiber, and a saddle mounted on the substrate for holding the optical fiber ferrule. The saddle comprises a pair of base layers distanced apart from each other so that the optical fiber ferrule can be inserted thereto; a sub-rib member extending upwardly from internal ends of the respective base layer; a center-rib member extending in a vertical upward direction from the center of the respective sub-rib member; an arm member displaced along the longitudinal direction of the optical fiber ferrule, and having a pair of welded sections for coupling the optical fiber ferrule thereto; a tapered reinforcing member extending from the respective arm member; and, a loop member having a bent shape coupled to both ends of the reinforcing sections.

Device for aligning optical source and optical fiber in optical source module

A high-speed optical modulator module which includes: a lead frame having an outer lead frame and an inner lead frame, the outer lead frame for receiving a high-speed signal; a substrate, in which a metal base having a matching impedance device, and a submount having a laser diode thereon, are formed; a first multi-bonding wire for electrically connecting the inner lead frame of the lead frame to one end of the matching impedance device; a second multi-bonding wire for electrically connecting the other end of the matching impedance device to one end of the metal base; and a dual-bonding wire for electrically connecting the other end of the metal base to the laser diode. The matching impedance device includes a matching resistor and a compensation capacitor connected in parallel. The module is formed by packaging and sealing the components other than the outer lead frame.

High-speed optical modulator module

Growing community of inventors

Kyongsangbuk-do, South Korea

Ki-Soo Park