Electronics and Telecommunications Research Institute

Ki-Seok Jang

Kwang-Seong Choi

Jiho Joo

Seok-Hwan Moon

Gwang-Mun Choi

Chanmi Lee

Yong-Sung Eom

Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.

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Daejeon, South Korea

Ki-Seok Jang