Samsung Electronics Co., Ltd.

Ki-ju Sohn

Dong-wook Kim

Joon-Ho Lee

Ho Jun Yu

Sung-hyup Kim

Ju-hyun Lee

Byeong-sang Kim

Kyung-bin Park

A film frame, a system for manufacturing a display substrate, and a method of manufacturing a display substrate, the film frame including a pair of frame edges extending lengthwise in a first direction and arranged opposite to each other; a fixed end clamp connected to the pair of frame edges and extending lengthwise in a second direction perpendicular to the first direction; and a free end clamp between the pair of frame edges, the free end clamp extending lengthwise in the second direction and configured to be detachably coupled with the pair of frame edges, wherein the fixed end clamp includes a first magnetic fixer extending lengthwise in the second direction and a second magnetic fixer on the first magnetic fixer, and the free end clamp includes a third magnetic fixer extending lengthwise in the second direction and a fourth magnetic fixer on the third magnetic fixer.

Film frame, display substrate-manufacturing system, and display substrate-manufacturing method

A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.

Wafer to wafer bonding method and wafer to wafer bonding system

Growing community of inventors

Gunpo-si, South Korea

Ki-ju Sohn