Samsung Electro-mechanics Co., Ltd.

Ki Joo Sim

Do Jae Yoo

Jong In Ryu

Jin Su Kim

Won Seok Lee

Ki Ju Lee

Hee Jung Jung

Hyun Seok Yang

Chan Jin Park

Mi Jeong Jeon

Young Ook Cho

A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.

Printed circuit board

A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Semiconductor package with improved signal stability and method of manufacturing the same

A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

Double-sided package module and substrate strip

Growing community of inventors

Suwon-si, South Korea

Ki Joo Sim