Hynix Semiconductor Inc.

Ki Ill Moon

Hyung Gil Baik

Ji Yon Kim

Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the same. The semiconductor chips are glued on each of upper and lower circuit boards, which have active surfaces facing each other; the chip pads are connected to each of the upper and lower circuit boards with gold wires; the upper and lower circuit boards are joined together with bumps interposed between them for electrical connection; the upper circuit board is included in a package mold; and the opposite ends of the lower circuit board are exposed to the lower portion of the package mold. The lower circuit board can be made of flexible insulation film. The exposed opposite ends of the lower circuit board can have solder balls formed thereon. Also, the opposite ends of the lower circuit board may be joined to a printed circuit board. Solder balls may be formed on the lower surface of the printed circuit board. The upper circuit board may be composed of a lead frame. The package according to the present invention is a stacked package capable of increasing memory capacity of a single package by at least 200% and combining both advantages of FBGA packages and of center pad type semiconductor chips.

Ball grid array package with stacked center pad chips and method for manufacturing the same

The present invention relates to manufacture of a stacked chip package. A first substrate including a first center window is attached to a first semiconductor chip having a plurality of bonding pads arranged on the center part. A first bonding wire is formed to connect the first semiconductor chip and the first substrate. A second substrate including a second center window is attached to a second semiconductor chip having a plurality of bonding pads arranged on the center part. A second bonding wire is formed to connect the second semiconductor chip end the second substrate. The backsides of the resulting first and the second semiconductor chips are attached. A third bonding wire is formed to connect the first and the second substrates. A molding body is formed to overlay the first, the second and the third bonding wires. A conductive ball is adhered to the first substrate.

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Kyoungki-do, South Korea

Ki Ill Moon