Kolon Industries, Inc.

Ki Il Hong

Hak Gee Jung

Hyo Jun Park

Gi Sang Song

Hak-Gee Jung

Hak Yong Woo

Woong Ki Min

Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.

Polyimide cover substrate

This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (&#x2014;CONH&#x2014;).

High heat-resistant polyamic acid solution and polyimide film

The present invention relates to a thermo-shrinkable polyester film with a superior thermal shrinkage, which has an orientation angle of a molecular chain in a range of from 0&#xb0; to about &#xb1;10&#xb0; relative to a main shrinkage direction, and a molecular orientation ratio (MOR) in a range of from 1.29 to about 2.5, thereby preventing a label made from the film from curling or waving.

Growing community of inventors

Yongin-si, South Korea

Ki Il Hong