Semes Co., Ltd.

Samsung Display Co., Ltd.

Ki Hoon Choi

Tae Hee Kim

Hyo Won Yang

Hyun Yoon

Anton Koriakin

Yo Han Lee

Dong In Kim

Ji Hoon Jeong

Hae-Won Choi

Pil Kyun Heo

Hyun Seok Hong

In Ki Jung

Jung Bong Choi

Joon Ho Won

Eung Su Kim

Jin Yeong Sung

Young Hoon Jeong

Myung Jin Kim

Jang Mi Woo

Jin Su Park

Sang Min Lee

Min Woo Kim

Se Hoon Oh

Oh Jin Kwon

Jin Kyu Park

Ju Won Kim

Young Dae Chung

Chan Young Heo

Young Ho Park

Jung Keun Cho

Do Heon Kim

Tae Keun Kim

Jin Se Park

Hae Won Choi

Jae Seong Lee

Jang Jin Lee

Kyo Woog Koo

Gyo-Woog Koo

Ji Soo Jeon

Sang Hyeon Ryu

The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.

Irradiating module, and substrate treating apparatus including the same

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support and rotate a substrate at the treating space; a liquid supply unit configured to supply a liquid to a substrate supported on the support unit; a post-treating unit configured to perform a post-treatment on the substrate supported on the support unit; and a monitoring unit configured to inspect a state of a liquid film formed of the liquid supplied onto the substrate.

Apparatus for treating substrate and method for treating a substrate

The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space; and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.

Method and apparatus for treating a substrate

The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.

Apparatus and method for treating substrate

A photomask correction method capable of increasing the photomask precision is provided. The photomask correction method comprises measuring an intensity profile of a laser, acquiring etching amount data corresponding to the measured intensity profile using a library, determining a process parameter of the laser based on the etching amount data, and correcting a photomask with the laser according to the determined process parameter.

Apparatus for correcting photomask and method thereof

A printing apparatus and a method of providing printing apparatus are provided. A printing apparatus according to at least one embodiment of the present disclosure includes a base panel or head base, at least one or more head packs installed on the head base, a head pack holder installed on each of the head packs and configured to handle and fix the head pack, and a fastening structure configured to mount the head pack holder to the head packs.

Printing apparatus and providing method thereof

Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.

Apparatus for treating substrate and apparatus for measuring concentration

The present disclosure provides a droplet discharging device capable of minimizing misalignment of a plurality of heads. The droplet discharging device comprises a base including a head fixing region to which a plurality of heads are fixed; a pack holder disposed on the base and including an opening penetrated by the plurality of heads installed on the base; a guide pin installed on the pack holder and protruding towards the base; a guide holder installed on the base and fastened to the guide pin; a first fastening part installed on the pack holder and protruding towards the base; and a second fastening part installed on the base and fastened to the first fastening part, wherein a lock air is supplied to one of the first fastening part and the second fastening part, thus fastening the first fastening part and the second fastening part.

Droplet discharging device and manufacturing method thereof

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.

A supercritical processing apparatus includes an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof. A space is defined between the upper and lower vessels and configured to allow a substrate to be placed therein. The upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole.

Supercritical processing apparatus

Disclosed is a liquid crystal display device, including: a first substrate including a display area displaying an image, and a non-display area disposed in a form surrounding the display area; a second substrate spaced apart from the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate; and a first static electricity absorbing pattern disposed on the non-display area of the first substrate.

Liquid crystal display device

A display device includes a timing controller, a driver, and a display panel. The timing controller outputs a first clock signal having first rising time during an active section and a second clock signal having second rising time during a blank section adjacent to the active section. The driver generates a data signal based on the first clock signal and the second clock signal and to output the data signal. The display panel displays an image based on the data signal. The first rising time is shorter than the second rising time.

Display device and method of driving the same

Embodiments of the inventive concepts provide an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit supporting the substrate, and a liquid supply unit supplying a treatment solution to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle discharging the treatment solution to the substrate, a liquid supply line supplying the treatment solution to the nozzle, a mixing member installed on the liquid supply line, a mixing space formed within the mixing member, and a gas supply line connected to the mixing member to supply a gas into the mixing space. The mixing member includes a body within which the mixing space is formed, and an inflow port combined with the body such that the gas supplied through the inflow port is mixed with the treatment solution in the mixing space to form nano-sized bubbles.

Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.

Single type substrate treating apparatus and method

A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.

Growing community of inventors

Cheonan-si, South Korea

Ki Hoon Choi