Korea Kumho Petrochemical Co., Ltd.

Ki-Dae Kim

Seong-Ju Kim

Joo-Hyeon Park

Sun-Yi Park

Ji-Hong Kim

Dae Young Lee

Hosull Lee

Ji Hong Kim

Dae-Youp Lee

Dong-Chui Seo

Seong-ju Kim

A copolymer having a repeating unit represented by the following general formula I and a chemical amplification positive photoresist composition having the copolymer and a photoacid generator. The photoresist can allow for a good pattern shape even though a post-baking is taken in a somewhat delayed time and for a use of any radiation, such as uv light, deep uv light and charged particle beam. Also, it is superior in storage stability and resolution so that it is useful for the high integration of semiconductor devices. The polymer ranges, in polystyrene-reduced average molecular weight, from 1,000 to 1,000,000. The polymer is represented by the following repeating pattern: ##STR1## wherein, R.sub.1, R.sub.2 and R.sub.3 independently represent a hydrogen atom or a methyl; R.sub.4, R.sub.5 and R.sub.6 independently represent a hydrogen atom, an alkyl group, an alkoxy group or a halogen; 1, m, n each is a repeating number satisfying the condition that 0.3&lt;1/(m+n)&lt;0.9, 0.1&lt;m/(1+n)&lt;0.6 and 0.01&lt;n/(1+m)&lt;0.5; h and g, which may be different and the same, each are an integer of 0-8; and Am represents NR.sub.7 R.sub.8, a cyclic secondary amine, or a heterocyclic secondary amine containing an oxygen or sulfur atom, wherein R.sub.7 and R.sub.8 independently represent a hydrogen atom, an alkyl group, an aryl group or a phenyl group.

Copolymer useful for positive photoresist and chemical amplification

A positive chemical amplified photoresist composition having as a matrix resin a polymer having the repeating unit of Formula (I) and a photoacid generator. The polymer ranges, in polystyrene-reduced weight average molecular weight, from about 2,000 to 1,000,000. The photoresist composition is possible to develop in alkali and shows excellent sensitivity, resolution and transmissivity to deep uv light in addition to being superior in storage preservativity. The repeating unit of Formula (I) is: ##STR1## wherein, R.sub.2, R.sub.2 and R.sub.3 are independently represented by a hydrogen atom or a methyl group; R.sub.4 is a hydrogen atom, an alkyl group or an alkoxy group; R.sub.5 is functions as an acid-labile protective group and is selected from a t-butyl group, a tetrahydropyranyl group or an alkoxymethylene group; j is an integer of 1-8; k is an integer of 0-8; and 1, m and n each represent a mole ratio, satisfying the condition of l+m+n=1 where 0&lt;1&lt;0.4.

Polymer for positive photoresist and chemical amplified positive

A chemical amplified positive photoresist composition including a resin having the repeating unit of Formula I and a photoacid generator. The resin ranges, in polystyrene-reduced molecular weight, from about 2,000 to 1,000,000. In Formula I, k and l each represent a mole ratio satisfying the condition of k+l=l. R.sub.1 is a hydrogen atom or a methyl group. R.sub.2 and R.sub.3 are independently either a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group. R.sub.4 is an acetate group, a t-butoxycarbonyl group, a benzyl group, a trialkylsilyl group or an alkyl group. The photoacid generator which generates an acid by radiation. ##STR1##

Positive photoresist resin and chemical amplified positive photoresist

A three-component chemical amplified photoresist composition, comprising: an alkali soluble resin; a dissolution inhibitor of aromatic polyhydroxy compound substituted by at least two acid-decomposable radicals; and a photo acid generating agent of an onium salt, which is capable of forming good profiles when exposed to light with a short wavelength and is superior in heat resistance and storage stability.

Three-component chemical amplified photoresist composition

A positive photoresist composition, including an alkali soluble novolak resin, an esterification compound represented by the following formula II as a photosensitive agent and a solvent: ##STR1## wherein R.sub.1 through R.sub.3 are independently selected from a hydrogen atom, an alkoxy group and an alkyl group containing 1 to 4 carbon atoms and are different from or the same as one another, and

Positive photoresist composition containing quinone diazide 5-triazine

There are disclosed novel photoresist compositions employing phosphazene compounds as ballast, unabsorbent of light at a band of i-line and g-line and superior in thermal resistance and sensitivity as well as resolution, characterized by introducing photosensitive groups into phosphazene type ballast represented by the following formula I: ##STR1##

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Taejeon, South Korea

Ki-Dae Kim