Qualcomm Incorporated

Khushboo Kumari

Santhosh Reddy Akavaram

Prakhar Srivastava

Chintalapati Bharath Sai Varma

Ravi Kumar Sepuri

An integrated circuit (IC) device, implemented using chiplets mounted on a substrate, may include a controller and a first plurality of link modules. The first plurality of link modules may be configured to provide data lanes in a multimodule data communication link. The controller may be configured to retrain a failed link module in the first plurality of link modules while one or more other link modules in the first plurality of link modules are active and available for transmitting or receiving data, reconfigure the multimodule data communication link to use a second plurality of link modules that excludes the failed link module and includes fewer link modules than the first plurality of link modules, and reconfigure the multimodule data communication link to use the first plurality of link modules for transmitting or receiving the data after the failed link module has been successfully retrained.

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Noida, India

Khushboo Kumari