Dow Corning Corporation

Khristopher Edward Alvarez

James Steven Tonge

Nick Evan Shephard

Michael Raymond Strong

Ann Walstrom Norris

Myron T Maxson

Shizhong Zhang

Michael Allen Stanga

Chad Martin Amb

Michael John Watson

Brandon W Swatowski

Kiersten Lynn Shephard

Beth Ann Witucki

Sarah Breed

Paul Anthony Berry

Roger Allen Frazer

A curable composition comprises a cationic polymerizable material. The curable composition further comprises a diluent component comprising a silane compound having a single silicon-bonded cationic polymerizable group. A method of forming a cured article with the curable composition is also disclosed. The method comprises applying the curable composition on a substrate to form a film. The method further comprises curing the film on the substrate to form the cured article. The present invention also provides the cured article formed in accordance with the method.

Curable composition, method of preparing cured article, and cured article formed thereby

A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (RSi0), (RSi0), (SiO), (R'), and (RSi0), where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3. 

Dual curing polymers and methods for their preparation and use

A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).

Process for minimizing electromigration in an electronic device

A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R2Si0)b, (RSi0)c, (Si0)d, (R)f, and (R3SiO)g, where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3. 

Fire resistant sealant composition

A silicone gel composition, (A) 100 parts by weight of a first polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule and having a viscosity of from 0.2 to 10 Pa&middot;s at 25&deg; C.; (B) at least about 0.5 part by weight of a second polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, wherein the second polydiorganosiloxane has a viscosity at 25&deg; C. of at least four times the viscosity of the first polydiorganosiloxane at 25&deg; C.; (C) an organohydrogensiloxane having the average formula R,Si(SiOR,H),wherein R,is an alkyl group having 1 to 18 carbon atoms or aryl, R,is an alkyl group having 1 to 4 carbon atoms, in an amount sufficient to provide from 0.1 to 1.5 silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; and (D) a hydrosilylation catalyst in an amount sufficient to cure the composition. A silicone gel comprising a reaction product of the silicone gel composition. A kit for preparing a silicone gel composition.

Silicone gel composition and silicone gel produced therefrom

Polyorganosiloxane gels are prepared using compositions curable by a platinum catalyzed hydrosilation reaction that are characterized by the presence of a non-functional silicone fluid. The gel may contain additional components and may also be formulated into a multi-part system.

Routes to dielectric gel for protection of electronic modules

A curable composition which contains an alkenyl group containing polyorganosiloxane, an organosilicon compound having two silicon-bonded hydrogen atoms, a hydrosilylation reaction catalyst, and a glass frit, which is suitable, upon cure, for use as a firewall sealant.

Growing community of inventors

Midland, MI, United States of America

Khristopher Edward Alvarez