Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Intellectual Discovery Co., Ltd.

Avago Technologies General IP Pte, Ltd.

Other

Agilent Technologies, Inc.

Avago Technologies IP (singapore) Pte. Ltd.

Bench Walk Lighting, LLC

Kheng Leng Tan

Keat Chuan Ng

Chiau Jin Lee

Kee Yean Ng

Wen Ya Ou

Norfidathul Aizar Abdul Karim

Kiam Soon Ong

Janet Bee Yin Chua

Su Lin Oon

Ju Chin Poh

Chuan Hoe Chan

Aizar Abdul Karim Norfidathul

Wei Liam Loo

Siew It Pang

Thye Linn Mok

Yew Cheong Kuan

Kum Soon Wong

Tajul Arosh Baroky

Kok Chin Pan

Fakhrul Arifin Mohd Afif

Kian Shin Lee

Sundar Natarajan Yoganandan

Hui Peng Koay

Bit Tie Chan

Kwok Yuen Ng

Choon Guan Ko

Tong Fatt Chew

Lig Yi Yong

Ak Wing Leong

Boon Chun Tan

Sundar Natarajan Yogananadan

Klan Shin Lee

Slew It Pang

Abdul Karim Aizar

Chaiu Jin Lee

Keat Chaun Ng

Abdul Karim Norfidathul Aizar

Alzar Abdul Karim Norfidathul

A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed.

Light source with tunable CRI

An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations.

Minimized color shift lighting arrangement during dimming

A lighting system and method are disclosed. Specifically, the lighting system includes a hybrid canopy that can provide an optimum light beam shape for a number of different lighting applications. The hybrid canopy is equipped with lighting clusters of different types, thereby enabling a broader beam output without sacrificing beam intensity or brightness.

Hybrid canopy lighting for optimum light beam shaping

A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.

High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink

In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Semiconductor device with an interlocking wire bond

A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light.

High thermal conductivity and low degradation die attach with dual adhesive

In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Semiconductor device with an interlocking structure

A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.

Light source package and method of manufacturing the same

An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device.

System, device, and method for adjusting color output through active cooling mechanism

In one embodiment, a light-emitting device having a body, a reflector, a light source die, and a spectral converter is disclosed. The spectral converter may be formed adjacent to, but distanced away from, the light source die. The spectral converter may be configured to spectrally adjust a portion of the light output having a predetermined spectral content. In another embodiment, a system for illumination having a plurality of lighting assemblies is disclosed. Each of the lighting assemblies comprises a spectral converter configured to spectrally adjust a portion of the light output so that the plurality of lighting assemblies are configured to emit substantially similar spectral output. In yet another embodiment, a lighting apparatus having the spectral converter is disclosed.

Lighting device with spectral converter

A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member.

Cooling system utilizing potential energy

In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed.

Lighting device and apparatus with spectral converter within a casing

An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.

Light source

Embodiments of light sources are disclosed herein. An embodiment of the light source comprises a lead frame having a first side and a second side. A hole extends through the lead frame between the first side and the second side. An adhesive is located in the hole and extends beyond the hole, wherein the adhesive extends beyond the diameter of the hole on the first side and the second side of the first lead frame. A light emitter adhered to the adhesive proximate the first side of the first lead frame.

Light emitter

A surface mount light emitting device package with mechanical latching means for locking a lens on to the package is provided. The surface mount light emitting package may include an encapsulation layer or a lens, a lead frame, at least one lead, a body, a die, and a layer of transparent gel encapsulant material. The lead frame may include at least one protrusion which is bent upward to from at least one latch for engaging the lens.

Light emitting package with a mechanical latch

Growing community of inventors

Penang, Malaysia

Kheng Leng Tan