Samsung Electronics Co., Ltd.

Khee Park

Jin Hee Yoon

Oh Soo Kwon

Kug Sang Lee

Gi Y Jeon

A method and apparatus for vertically mounting a semiconductor package is disclosed. The mounting apparatus has an extended (e.g. rectangular) shape, and is provided with a plurality of spaces adapted to receive and hold vertically semiconductor packages. To mount a semiconductor package in such a manner, the package is first inserted into a space in the apparatus provided therefor and fixedly held there. Next, a plurality of such semiconductor packages which are so held by the mounting apparatus are positioned on a printed circuit board, and their leads are soldered thereto to complete the mounting process. This facilitates both surface mounting and multi-layer wiring and decreases the potential for poor quality soldering. In addition, the mounting apparatus according to the present invention is beneficially heat dissipative, which helps to increase the life of a semiconductor package by heat which can cause deleterious thermal stresses.

Semiconductor package vertical mounting device and mounting method

A chip-lifetime testing instrument for semiconductor devices which can detect defective chips by testing the performance and electrical lifetime of the chips in manufacturing process of the semiconductor devices, so that the manufacturing cost can be reduced and unnecessary processes for packaging of defective chips can be avoided, thereby reducing the necessary space for the set-up of the testing instrument.

Growing community of inventors

Seoul, South Korea

Khee Park