Infineon Technologies Ag

Khai Seen Yong

Kok Kiat Koo

Upendra Balehithlu Manjappaiah

A semiconductor device includes a first contact element, a second contact element, a semiconductor chip, and an encapsulation material. The first contact element is on a first side of the semiconductor device. The second contact element is on a second side of the semiconductor device opposite to the first side. The semiconductor chip is electrically coupled to the first contact element and the second contact element. The encapsulation material encapsulates the semiconductor chip and portions of the first contact element and the second contact element. The encapsulation material defines at least two notches on a third side of the semiconductor device extending between the first side and the second side.

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Johor, Malaysia

Khai Seen Yong