Delta Design, Inc.

Kexiang Ken Ding

Samer Kabbani

James Frandsen

Michael Anthony Laver

Luis A Muller

Kenneth B Uekert

Chris Do

Jerry Ihor Tustaniwskyj

Keith E Emery

Yun David Tang

Alton R Lindsey, Jr

Stephen Aloysius Wetzel

Walter James Frandsen, Jr

Michel Mabene

Xiyou Wang

John Marquez

Brian Avery

Torsak Sethanant

A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.

Light line imager-based IC tray pocket detection system

An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.

IC device-in-pocket detection with angular mounted lasers and a camera

A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.

Micro-vision alignment system with guiding rings for IC testing

A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light source is disposed at an acute angle to the integrated circuit device, and is configured to illuminate the leads such that lead shadows are created in a first color plane. The second light source is disposed in front of a surface of the integrated circuit device on which the leads are mounted, and is configured to illuminate the leads in a second color plane. The camera is configured to image the illuminated leads and lead shadows. The processor is configured to analyze the first and second color planes of a single image to detect three-dimensional bent leads.

Method and apparatus for IC 3D lead inspection having color shadowing

A system for double sided integrated circuit device testing includes: (i) a picking section including: (a) a plurality of picking-section pockets; (b) a picking-section plate including: one or more picking-section pocket openings, and first and second picking-section plate pins; (ii) a placing section including: (a) a plurality of placing-section contactors; (b) a placing-section member including: one or more placing-section contactor openings, and first and second placing-section member pins; and (iii) a pick-and-place section including: (a) a pick-and-place device including: a plurality of pick-and-place head contactors, and one or more sets of actuators; and (b) a pick-and-place head plate including: one or more pick-and-place head contactor openings, each pick-and-place head contactor opening corresponding to a pick-and-place head contactor, and first and second spring-loaded bushings configured to engage with the first and second picking-section plate pins, and the first and second placing-section member pins.

Group vision alignment for double sided IC device testing

A system for detecting characteristics of a surface includes multiple sources of lights, a platform structure configured to support the surface, a lens aligned with the platform structure, a cropping aperture, and an image receiver. The platform structure is configured to receive light from the source of light and the lens is positioned such that the source of light is not in focus, but the detected surface is in focus. The cropping aperture is configured to crop light reflected from the surface, and the image receiver is configured to receive the light conditioned by the cropping aperture.

Imaging system with defocused and aperture-cropped light sources for detecting surface characteristics

A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime.

Up-look camera based vision apparatus to auto align pick-and-place positions for device handlers

A method and apparatus for aligning a device with a contactor is provided. The apparatus includes a pick and place device, for transporting the device. A first camera acquires an image of the device relative to device holder fiducials of the pick and place device. A second camera detects the location of the contactor relative to fiducials positioned on an alignment frame plate. A third camera to image frame and device holder fiducials to correlate the first and second camera coordinates. Given a processor determines the alignment difference between the device and the contactor. A plurality of actuators align the device with the contactor.

Vision alignment with multiple cameras and common coordinate at contactor for IC device testing handlers

A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms.

A vision alignment system and method is provided. The vision alignment system includes one or more grouped alignment plates with guiding inserts configured to receive multiple devices, and groups of three actuators, configured to actuate the alignment plates to correct the position offsets of multiple devices as a group. The position offsets between the device and contactor are determined by a device-view camera during runtime and a contactor-view camera during calibration time. The vision alignment system also includes a pick-and-place handler, configured to transport devices.

Camera based vision alignment with device group guiding for semiconductor device testing handlers

An inspection system, for inspecting pin grid arrays on integrated circuit devices includes a pin base mask configured to receive a device having a pin grid array. A dark-field, low-angle lighting system emits light onto the pin grid array. The pin base mask and low-angle lighting system provide for a clear and definitive image of the pin grid array. A camera captures the image of the pin grid array. A processor, coupled to the camera, analyzes the images captured by the camera. Based on the captured image, the processor determines whether any pins on the pin grid array are bent or missing, or whether there are extra pins present.

Camera based pin grid array (PGA) inspection system with pin base mask and low angle lighting

A guiding plate based vision alignment system for a test handler includes cameras, configured to view the position difference between a tested device and the corresponding contactor. A pick-and-place handler is configured to move the device. A guiding plate is configured to actuate guiding plate with one translation alignment feature and one rotation alignment feature to correct the position offset between the tested device and the corresponding contactor.

Camera based two-point vision alignment for semiconductor device testing handlers

A LED lighting system for reading multiple data matrix codes on device populated transport media with a line scan camera, includes a light housing, a plurality of LED circuit bars, having a plurality of LEDs, mounted to an inner surface of the light housing arranged to provide high angle lighting and low angle lighting and a light controller operatively connected to the light housing to selectively control the light intensity, the light distribution and the angle of the LEDs on each of the plurality of LED array bars, whereby the LED lighting system can reduce texture noise and detect contrast in color or contrast in texture on the device populated transport media. The LED lighting system includes a device cooling system having an air compressor for cooling the LEDs such that they can operate at an optimal level.

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San Diego, CA, United States of America

Kexiang Ken Ding