Apple Inc.

Kevin Z Lo

Frank Faqiu Liang

Vinh H Diep

Po Weng Chiu

Jonathan A Matheson

Judith C Segura

Brian L Chuang

Leanne Bach Lien T Ly

Lukose Ninan

Chong Li

Paul Xiaopeng Wang

Alex Joseph Lehmann

Stephen E Dey

Chang Zhang

Madeleine S Cordier

Luis R Deliz Centeno

Benjamin R Blachnitzky

Tianjia Sun

Nicolai Philip Georg

Jian H Li

Yuhao Pan

Hongcheng Sun

Jonathan C Atler

Lilli Ing-Marie Jonsson

Paul N DuMontelle

Sang E Lee

Joon-Sup Han

Minhazul Islam

Alhad A Palkar

Lilli Ing-Marie Johnsson

Hongchen Sun

Paul N Dumontelle

Luis Deliz Centeno

Jian Li

A system may include finger devices. A touch sensor may be mounted in a finger device housing to gather input from an external object as the object moves along an exterior surface of the housing. The touch sensor may include capacitive sensor electrodes. Sensors such as force sensors, ultrasonic sensors, inertial measurement units, optical sensors, and other components may be used in gathering finger input from a user. Finger input from a user may be used to manipulate virtual objects in a mixed reality or virtual reality environment while a haptic output device in a finger device provides associated haptic output. A user may interact with real-world objects while computer-generated content is overlaid over some or all of the objects. Object rotations and other movements may be converted into input for a mixed reality or virtual reality system using force measurements or other sensors measurements made with the finger devices.

Computer systems with finger devices

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Combination parallel path heatsink and EMI shield

Growing community of inventors

Belmont, CA, United States of America

Kevin Z Lo