Raytheon Company

University of Massachusetts

Kevin Wilder

Thomas V Sikina

James E Benedict

Andrew R Southworth

John P Haven

Mary K Herndon

Erika Klek

Alkim Akyurtlu

Mikhail Pevzner

Michael Ryan Souliotis

Oshadha K Ranasingha

Matthew Souza

Aaron Michael Torberg

Gregory M Fagerlund

Phillip W Thiessen

Jonathan E Nufio-Molina

Timothy David Deley

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Wall for isolation enhancement

An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.

Segmented patch phased array radiator

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Method for fabricating Z-axis vertical launch

A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

Radio-frequency (RF)-interface and modular plate

A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

Advanced communications array

An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.

Interlocking modular beamformer

Apparatus for fabricating Z-axis vertical launch within a printed circuit board

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250&#xb0; C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

Thick film resistors having customizable resistances and methods of manufacture

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250&#xb0; C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

A multilayer printed circuit board includes a first dielectric layer and a second dielectric layer, each layer having a top surface and a bottom surface. The first dielectric layer is positioned above the second dielectric layer with the bottom surface of the first dielectric layer facing the top surface of the second dielectric layer. The top surface of the second dielectric layer has a conductive trace. The second dielectric layer has a through-hole that extends through the conductive trace. The multilayer printed circuit board includes an inverted pad interface structure including an inverted pad provided on the bottom surface of the first dielectric layer, a first solder layer provided on a surface of the inverted pad, a second solder layer provided on the conductive trace, and a copper wire positioned within the through-hole to provide the vertical and electrical connection with the conductive trace.

Growing community of inventors

Derry, NH, United States of America

Kevin Wilder