Micron Technology Incorporated

Micron Display Technology, Inc.

Kevin W Tjaden

David A Cathey

John K Lee

James J Alwan

J Brett Rolfson

Terry N Williams

Behnam Moradi

Fred L Roe

G Hugo Urbina

Trung Tri Doan

David H Wells

Tyler A Lowery

A substrate is placed on a charging surface, to which a first voltage is applied. Etch-resistant dry particles are placed in a cup in a nozzle to which a second voltage, less than the first voltage, is applied. A carrier gas is directed through the nozzle, which projects the dry particles out of the nozzle toward the substrate. The particles pick up a charge from the potential applied to the nozzle and are electrostatically attracted to the substrate. The particles adhere to the substrate, where they form an etch mask. The substrate is etched and the particles are removed. Emitter tips for a field emission display may be formed in the substrate.

Microstructures including hydrophilic particles

A semiconductor device for use in field emission displays includes a substrate formed from a semiconductor material, glass, soda lime, or plastic. A first layer of a conductive material is formed on the substrate. A second layer of microcrystalline silicon is formed on the first layer. This layer has characteristics that do not fluctuate in response to conditions that vary during the operation of the field emission display, particularly the varying light intensity from the emitted electrons or from the ambient. One or more cold-cathode emitters are formed on the second layer.

Light-insensitive resistor for current-limiting of field emission displays

A field emission display having a base plate which has a focus ring structure substantially planar with the extraction grid. The field emission display base plate is fabricated on a substrate having a cathode including an. emitter tip formed thereon by depositing a first insulating layer, a first conductive layer over the first insulating layer, etching the first conductive layer, depositing a second insulating layer over the etched first conductive layer, and depositing a second conductive or focus ring layer over the second insulating layer. A second selective etching may be formed to further define the gate and focus ring structures.

Composite self-aligned extraction grid and in-plane focusing ring, and method of manufacture

A field emission display having a base plate which has a focus ring structure substantially planar with the extraction grid. The field emission display base plate is fabricated on a substrate having a cathode including an emitter tip formed thereon by depositing a first insulating layer, a first conductive layer over the first insulating layer, etching the first conductive layer, depositing a second insulating layer over the etched first conductive layer, and depositing a second conductive or focus ring layer over the second insulating layer. A second selective etching may be formed to further define the gate and focus ring structures.

A method for fabricating sharp asperities. A substrate is provided which has a mask layer disposed thereon, and a layer of micro-spheres is disposed superjacent the mask layer. The micro-spheres are for patterning the mask layer. Portions of the mask layer are selectively removed, thereby forming circular masks. The substrate is isotropically etched, thereby creating sharp asperities.

Methods of making an etch mask and etching a substrate using said etch mask

The present invention is a baseplate that has a supporting substrate with a primary surface upon which an array of emitters is formed. An insulator layer with a plurality of cavities aligned with respective emitters is disposed on the primary surface, and an extraction grid with a plurality of cavity openings aligned with respective emitters is deposited on the insulator layer. The extraction grid is made from a silicon based layer of material. A current control substrate formed from the silicon based layer of material of the extraction grid is provided such that the current control substrate is electrically isolated from the extraction grid and electrically connected to the emitters. The current control substrate has sufficient resistivity to limit the current from the emitters.

Baseplate and a method for manufacturing a baseplate for a field emission display

Method of manufacture of composite self-aligned extraction grid and in-plane focusing ring

Method of forming an array of emitter tips

The disclosed polishing apparatus includes a lower pad and an upper pad. The upper pad is disposed over the lower pad and has an upper abrasive surface. The lower pad has an upper surface defining one or more grooves. When the upper pad is placed over the lower pad, channels may form in the upper pad abrasive surface over the grooves. These channels improve the distribution of slurry in the polishing apparatus. The upper pad may define a first polishing region and a second polishing region, the total area of channels in the first polishing region being greater than the total area of the channels in the second polishing region.

Apparatus and method for semiconductor planarization

Method of forming an array of emmitter tips

Dry dispense of particles to form a fabrication mask

A method for forming semiconductor devices involves defining a pattern of microspheres on a first structure and transferring that pattern of microspheres to a semiconductor structure. The microspheres may then be used as a mask to define features on the semiconductor structure. In this way, it is possible to form semiconductor devices without necessarily using a stepper. This may result in substantial capital savings in semiconductor manufacturing processes.

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Boise, ID, United States of America

Kevin W Tjaden