Advanced Micro Devices Corporation

Globalfoundries Inc.

Kevin W Lim

Seah Sun Too

Zhen Zhang

Frank G Kuechenmeister

Michael Zhouying Su

Mohammad Zubair Khan

Jaime Bravo

Ranjit Gannamani

Kee Hean Keok

Soon Tatt Ow Yong

Azlina N Nayan

Various embodiments of a semiconductor chip device that include a circuit board and a stiffener frame and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a circuit board and coupling a stiffener frame to the circuit board. The stiffener frame includes a first opening that defines an interior wall. The interior wall includes a notch.

Circuit board with notched stiffener frame

Methods are provided for packaging a semiconductor die having a first surface. In accordance with an exemplary embodiment, a method comprises the steps of forming a trench in the first surface of the die, electrically and physically coupling the die to a packaging substrate, forming a sealant layer on the first surface of the die, forming an engagement structure within the trench, and infusing underfill between the sealant layer and the engagement structure and the packaging substrate.

Semiconductor device having a filled trench structure and methods for fabricating the same

Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.

Semiconductor chip package fixture

Growing community of inventors

Santa Clara, CA, United States of America

Kevin W Lim