Growing community of inventors

Kuna, ID, United States of America

Kevin W Hutto

Average Co-Inventor Count = 1.63

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 31

Kevin W HuttoSwarnal Borthakur (6 patents)Kevin W HuttoMarc Allen Sulfridge (3 patents)Kevin W HuttoAndrew Eugene Perkins (3 patents)Kevin W HuttoRoss S Dando (2 patents)Kevin W HuttoRichard A Mauritzson (1 patent)Kevin W HuttoSteven David Oliver (1 patent)Kevin W HuttoKevin W Hutto (11 patents)Swarnal BorthakurSwarnal Borthakur (87 patents)Marc Allen SulfridgeMarc Allen Sulfridge (57 patents)Andrew Eugene PerkinsAndrew Eugene Perkins (15 patents)Ross S DandoRoss S Dando (62 patents)Richard A MauritzsonRichard A Mauritzson (50 patents)Steven David OliverSteven David Oliver (39 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (6 from 38,023 patents)

2. Semiconductor Components Industries, LLC (2 from 3,597 patents)

3. Aptina Imaging Corporation (2 from 580 patents)

4. Nanoscopia (Cayman), Inc. (1 from 3 patents)


11 patents:

1. 9666638 - Methods for forming backside illuminated image sensors with front side metal redistribution layers

2. 9362330 - Methods for forming backside illuminated image sensors with front side metal redistribution layers and a permanent carrier layer

3. 8987874 - Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces

4. 8794050 - Fluid sample analysis systems

5. 8697473 - Methods for forming backside illuminated image sensors with front side metal redistribution layers

6. 8568535 - Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes

7. 8492198 - Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpieces

8. 8314498 - Isolated bond pad with conductive via interconnect

9. 8221557 - Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes

10. 7928582 - Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces

11. 7560371 - Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
1/8/2026
Loading…