Ferro Corporation

Kevin W Allison

Gordon J Roberts

Dana Lynn Hankey

Edward Stadnicar, Jr

Jason D Provance

Aziz S Shaikh

Todd K Williams

The present invention provides a unique method of making a barrier rib structure for a plasma display panel. Instead of employing the traditional screen printing method of making barrier ribs, the present invention employs a section of low temperature cofired ceramic dielectric. The unique method includes the steps of providing a fusible dielectric composition in an organic binder, applying the composition on a glass sheet, applying a photoresist composition, placing a mask over the coated plate to provide a pattern of openings in the photoresist corresponding to the pattern of the picture subcells, using a laser to remove the portions of the coating not covered by the photoresist to form the color subcells and heating the resulting assembly to a sintering temperature to fuse the dielectric composition to form the barrier rib structure and to fuse the barrier rib structure to the glass plate.

Method of making plasma display panels

The present invention provides a method of adherently depositing a thick film composition on an aluminum nitride substrate comprising the steps of providing an aluminum nitride substrate, providing a thick film composition, and applying the thick film composition on the aluminum nitride substrate. The thick film composition includes a glass frit binder, a conductive metallic material and a lithium-containing adhesion promoting compound.

Method of bonding a conductor composition including a lithium compound

A thick film paste composition adapted to be bonded onto an aluminum nitride substrate is provided which comprises (a) an electrical property regulating component present in an amount sufficient to control the electrical properties of said paste; (b) a lead free or low lead glass composition capable of bonding said electrical property regulating component to the surface of an aluminum nitride substrate.

Thick film paste compositions for use with an aluminum nitride substrate

A thick film conductor composition adapted to be bonded to an aluminum nitride substrate is provided which comprises a sufficient amount of conductive metallic material to render the conductor composition electrically conductive when bonded to the substrate, a glass frit binder for the metallic material capable of being bonded to the substrate, and a lithium containing compound capable of reacting with the substrate upon heating so as to aid in adherently bonding the conductor composition to the aluminum nitride substrate. A thick film conductor bonded onto the surface of an aluminum nitride substrate as well as a method of producing the same are also provided.

Thick film conductor compositions for use with an aluminum nitride

A thick film conductor, a process for producing such, and a thick film conductor paste of:

Thick film conductor employing copper oxide

A thick film conductor, a process for producing such, and a thick film conductor paste, of:

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Goleta, CA, United States of America

Kevin W Allison