Hewlett-packard Development Company, L.P.

Kevin Voss

Kuan-Ting Wu

Ya-Ting Yeh

Wei Kuang Chu

Ai-Tsung Li

Michael J Delpier

Wei-Chung Chen

Chi-Hao Chang

James Chang

David A Pipho

Kt (Kuan-Ting) Wu

Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

Multilayer housings

In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.

Thermal interface materials with adhesive selant for electronic components

In example implementations, a vapor chamber is provided. The vapor chamber includes a metallic housing. A nickel coating is applied on inside walls of the metallic housing. A silica derived carbon nanotube (CNT) aerogel coating is applied on the nickel coating on the inside walls of the metallic housing. The silica derived CNT aerogel coating is sprayed onto the nickel coating, dried and cured.

Coating for a vapor chamber

Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

Cover for devices

Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating.

Making a hydrophobic surface for an object

Provided in one example is an article. The article includes a substrate. The article includes a first layer disposed over at least a portion of the substrate, the first layer comprising a reflector. The article includes a second layer disposed over at least a portion of the first layer, the second layer comprising an electrode. The article includes a third layer disposed over at least a portion of the second layer, the third layer comprising a polymer and a light source. The article includes a fourth layer disposed over at least a portion of the third layer, the fourth layer comprising a diffusor. The article includes a fifth layer disposed over at least a portion of the fourth layer, the fifth layer comprising at least one of a photochromic material and a thermochromic material.

Articles having flexible substrates

A coated substrate may provide soft touch and superhydrophobicity. In example implementations herein, a substrate may be provided with a microstructure on at least a portion of at least one surface of the substrate. A first, water-based soft touch coating may be on at least a portion of the microstructure. A second, solvent-based superhydrophobic coating may be on at least a portion of the first coating.

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Houston, TX, United States of America

Kevin Voss