Skullcandy, Inc.

Kevin Sze

Peter M Kelly

Tetsuro Oishi

Xuan Shu

Thomas C Burton

Jon Lee Anderson

Joshua Brent Poulsen

Zack Leader

Mark T Niiro

Packaging inserts for headphones include a unitary body having two or more integral portions configured to fold relative to one another so as to partially enclose, support, and retain a headphone within the folded unitary body between the integral portions. Methods of packaging headphones include positioning a headphone on such a unitary body, and folding the unitary body around at least a portion of the headphones. Packaged headphone assemblies include a headphone, and such a packaging insert folded around at least a portion of the headphone.

Packaging for headphones, packaged headphones, and related methods

Modular audio systems comprise two speaker assemblies and a wiring system. Each speaker assembly may comprise a speaker and an audio jack integral to each speaker assembly. The wiring system comprises a first wiring assembly comprising two audio jacks configured to connect to the audio jacks of the two speaker assemblies and two wires connected to the two audio jacks at first ends of the two wires. Headphone assemblies may comprise two speaker assemblies and a headband configured for removable attachment to the speaker assemblies. Each speaker assembly may comprise an attachment structure configured for attachment to another device or structure, wherein the attachment structure of each speaker assembly of the two speaker assemblies comprises a frustoconical surface and two first attachment features comprising elongated features on the frustoconical surface.

Modular audio systems and related assemblies and methods

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Salt Lake City, UT, United States of America

Kevin Sze