Alliance for Sustainable Energy, LLC

Deere & Company

U.S. Department of Energy

Kevin Scott Bennion

Gilberto Moreno

Brij N Singh

Thomas J Roan

Desikan Bharathan

Kenneth F Kelly

Emily Cousineau

Sreekant Narumanchi

Jason A Lustbader

Xuhui Feng

Paul Philip Paret

Ramchandra Mahendrabhai Kotecha

Sreekant Venkat Jagannath Narumanchi

Matthew Thornton

Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

Condensers and electronic assemblies

The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Jet impingement manifolds for cooling power electronics modules

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Evaporator stacks and electronic assemblies

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Fluid-cooled heat sink for use in cooling various devices

The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices

Embodiments discussed herein are directed to managing the heat content of two vehicle subsystems through a single coolant loop having parallel branches for each subsystem.

Parallel integrated thermal management

Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.

Growing community of inventors

Littleton, CO, United States of America

Kevin Scott Bennion