Bystronic Laser Ag

Kevin Scharfenberg

The present disclosure is directed to a method for determining the bending angle on a bending machine, wherein the bending machine includes an upper tool and a lower tool for reshaping a workpiece by bending along a bending line. One or more measuring arrangements are positioned on the bending machine, which together include at least one illumination device and in each case at least one image acquisition device. Each measuring arrangement is assigned a different surface portion of the workpiece which lies laterally adjacent to the bending line and extends along the bending line. A light pattern is imaged on the workpiece by means of the at least one illumination device of a respective measuring arrangement onto the assigned surface portion. The light pattern contains a plurality of zones which are arranged side by side along the bending line.

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Munich, Georgia

Kevin Scharfenberg