Raytheon Company

Kevin R Hopkins

David James Knapp

Glafkos K Stratis

Douglas Mills

Chad E Boyack

Michael S Smith

Raymond A Graffam

Brendon R Holt

Thomas H Lind

Charles A Hale

Reagan Branstetter

An ultra-wide band (UWB) radio frequency (RF)/optical aperture includes a substrate having a plurality of regions. The plurality of regions may have varying characteristics and properties. In some embodiments, the plurality of regions includes a first region having a first relative dielectric constant and being transparent to signals having a frequency in a first frequency range, a second region contained in the first region and having a second relative dielectric constant and being transparent to signals having a frequency in a second frequency range, and a third region contained within the second region and having a third relative dielectric constant and being transparent to signals having a frequency in a third frequency range.

Ultra-wideband RF/optical aperture

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

UWB and IR/optical feed circuit and related techniques

Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.

Methods and apparatus for compact active cooling

A cooling device for cooling a cooled surface includes a manifold having a number of inlet slots for directing fluid into an enclosed volume or chamber, toward the cooled surface. The manifold has a number of exit ports for receiving the fluid from the enclosed volume or chamber after it has impinged upon the cooled surface. The inlet slots and exit ports may be rectangular, or may be otherwise elongated, so as to provide substantially spatially uniform heat removal from the cooled surface. The cooling device may be used for a wide variety of applications, for example for cooling small devices such as integrated circuits or other devices involving electronics.

Slot jet cooler and method of cooling

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Tucson, AZ, United States of America

Kevin R Hopkins