Air Liquide America, L.p.

L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des

American Air Liquide, Inc.

Other

Kevin P McKean

Frederick W Giacobbe

Robert W Connors

Frederic Rotman

Eric L Duchateau

Benjamin Jurcik

Benjamin J Jurcik, Jr

Apparatus and process for removing carbon monoxide from a gas stream comprising a major portion of an inert gas and a minor portion of carbon monoxide are provided. The process involves contacting a feed gas stream with at least a primary metal oxide in a reaction zone of a reactor vessel at conditions effective to convert substantially all of the carbon monoxide to carbon dioxide, thus producing a purified gas stream consisting essentially of the inert gas and carbon dioxide and substantially free of carbon monoxide. This process has (inter alia) a particular application as a tertiary purification process for producing a more highly purified source of gaseous nitrogen from a source of nitrogen originally produced from a conventional membrane air separation system, wherein the oxygen concentration in the nitrogen stream my vary around a setpoint value, and then further (or secondarily) purified by converting excess oxygen in the nitrogen to carbon monoxide and carbon dioxide using a fuel gas/combustion process, wherein the carbon monoxide concentration varies due to varying oxygen concentration in the feed stream to the combustion process.

Process and apparatus for removing carbon monoxide from a gas stream

The present invention relates to a wave soldering process wherein an inert gas atmosphere is injected inside the wave soldering machine, the inert gas atmosphere having a temperature which might be controlled. Particularly, the atmosphere can be heated at the same or different temperatures before injection, for example in the preheating zones, in the machine. The atmosphere can also be cooled (or injected at ambient temperature) e.g. in the cooling zone. Various atmospheres can be used (similar or different from one zone to another). Also, maintaining the atmosphere under forced laminer flow conditions improves the quality of the solder joints. The thermal efficiency of the heat transfer between the atmosphere and the printed circuit boards is thus greatly enhanced, which means less solder defects, higher components density and decrease of energy consumption and inert gas flow rate.

Process for wave soldering components on a printed circuit board in a

A circuit board is wave soldered as it is carried by a conveyor through a solder wave established in a solder reservoir. Disposed on both sides of the solder wave are gas plenums which discharge shield gas. The gas plenums include orifices for directing shield gas (i) at high velocity toward the solder wave to protect the solder wave with an atmosphere of shield gas, and/or (ii) upwardly toward an underside of the circuit board to strip entrained air therefrom. The solder wave is generated by a pump driven by a drive shaft that extends downwardly into the solder reservoir. An upper portion of the drive shaft is surrounded by a stationary hollow sleeve which projects into the solder reservoir to restrict the churning of the solder during rotation of the drive shaft. A shield gas is introduced into the sleeve to inert the solder being churned. An enclosure is positioned above the solder reservoir having an inlet and an outlet through which the circuit boards are conveyed. Curtains are positioned across portions of the inlet and outlet not occupied by the conveyor, the curtains being automatically adjusted when the width of the conveyor is adjusted.

Process and apparatus for the wave soldering of circuit boards

A circuit board is wave soldered as it is carried by a conveyor through a solder wave established in a solder reservoir. Disposed on both sides of the solder wave are gas plenums which discharge shield gas. Each gas plenum includes a top wall, a side wall, and a bottom wall. The side wall is spaced horizontally from the wave, and the bottom wall is submerged within the solder. The side and (optionally) top walls include orifices for directing shield gas (i) at high velocity toward the solder wave to protect the solder wave with an atmosphere of shield gas, and (ii) upwardly toward an underside of the circuit board to strip entrained air therefrom. Instead of being submerged within the solder, the bottom wall could be spaced above the solder and provided with orifices to emit shield gas downwardly between the plenum and solder reservoir to create an inert atmosphere above the solder. Dividers disposed within the plenum form sub-chambers communicating with orifices in respective walls of the plenum so that different gas velocities can be entitled from the orifices. The gas plenums can be rotatably adjustable and further adjustable either vertically or horizontally.

Growing community of inventors

Naperville, IL, United States of America

Kevin P McKean