Interconnect Portfolio LLC

Samsung Electronics Co., Ltd.

Silicon Pipe, Inc.

Hughes Electronics Corporation

Echostar Technologies Corporation

Novias, Inc.

Telocity, Incorporated

Kevin P Grundy

Joseph Charles Fjelstad

Para Kanagasabai Segaram

William F Wiedemann

Gary Yasumura

Inessa Obenhuber, Legal Representative

Thomas J Obenhuber

Matthew J Stepovich

Keith Mark Evans

Gary Yasamura

Craig Owens

Peter D Olson

William F Wiedermann

John K Seamons

Peter Otto Schmidt

Lawrence Herman Fong

A modular reconfigurable indoor antenna is disclosed. The antenna may include a bottom piece, a top piece, and a plurality of vertical members. The top piece may include an Ultra High Frequency (UHF) reception element. The plurality of vertical members may be disposed between the bottom piece and the top piece and coupled therewith. At least one of the plurality of vertical members may include a Very High Frequency (VHF) reception element.

Modular antenna system

Indoor antenna

An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Multi-surface IC packaging structures

Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

Low profile discrete electronic components and applications of same

An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.

Connector having a housing with a conductor with a ramp section and a curved surface section

A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed.

Memory chain

An ESD device with a protection structure utilizing radiated heat dissipation to prevent or reduce thermal failures. The device includes a voltage switchable polymerbetween electrodesand, which is configured to provide a heat radiating surfacefor radiating heat when an ESD condition occurs. A radiation transmission materialis disposed between the heat radiating surface and the environment for radiating heatwhen an ESD event occurs. One embodiment adds a spacerfor accurately spacing electrodes. A method for fabricating the device is further illustrated.

ESD protection utilizing radiated thermal relief

An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Electrical connector with conductors with a ramp to induce torsion

An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described.

Controlled impedance structures for high density interconnections

Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Growing community of inventors

Fremont, CA, United States of America

Kevin P Grundy