Hewlett-packard Development Company, L.p.

Kevin P DeKam

Sterling Chaffins

Chien-Hua Chen

Jayprakash C Bhatt

Mehrgan Khavari

Garry Dale Hinch

A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.

Fluid directing assembly

An ink is disclosed. The ink composition includes an ink vehicle, a colorant, and a fluorosurfactant, wherein the fluorosurfactant is a polymer having the general formula: wherein p is any integer, q is any integer, Zand Zare each fluorine or any functional group, and R, R, Rare each fluorine, any alkyl group, or any functional group, and wherein R, R, R, Z, and Zare not all fluorine and the fluorosurfactant lowers the surface tension of the ink vehicle. A method for improving a property of an ink is also disclosed.

Perfluoropolyethers as ink additives

In some embodiments, without limitation, a hydrophobic photoresist material and a method of making the photoresist material are provided. The photoresist material is derived by creating a high resolution insoluble, or more soluble, polymer structure as a result of a controlled chemical reaction with a functionalized perfluoropolyether. Also provided are methods of coating an inkjet printhead surface and processing the coated inkjet printhead surface.

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Albany, OR, United States of America

Kevin P DeKam