International Business Machines Corporation

Globalfoundries Inc.

Kevin O'Connell

Phillip V Mann

Joseph Paul Kuczynski

Arvind Kumar Sinha

Mark David Plucinski

Timothy Jerome Tofil

Karl Stathakis

Matthew Stephen Doyle

Chelsie M Peterson

Eric J Campbell

Alex Matos

Brenda Berg

William James Anderl

Christopher Michael Marroquin

Kory W Weckman

Mark Delorman Schultz

Shurong Tian

Michael Scott Good

Justin Christopher Rogers

Kenneth E Lubahn

Curtis Eugene Larsen

Arshad Alfoqaha

Janet Cederholm

Adam Spiegelman

Mehdi Hamid Vishkasougheh

John S Werner

Sarah K Czaplewski

Mark Kenneth Hoffmeyer

Karl Robert Erickson

Camillo Sassano

Sandra J Shirk/Heath

Samuel R Connor

George Francis Paulik

Chad M Albertson

George Russell Zettles, Iv

Daniel Ramirez

Arthur J Higby

Timothy Clyde Buchholtz

Nicholas Ollerich

Brandon R Christenson

Timothy Lindquist

Jarrett Betke

Yuanchen Hu

Connor L Smith

Piyush Kashyap

Alexander Matos

Provided is a damper system for an electronic equipment rack. The damper system may include an electronic equipment rack, a battery back-up unit, and a plurality of rails disposed within the electronic equipment rack. The battery back-up unit is slidably secured to the plurality of rails and tuned to dampen seismic oscillations of the electronic equipment rack during an earthquake. The battery back-up unit is also able to provide power to the electronic equipment disposed in the rack during a power outage.

Damper for an electronic equipment rack

A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Dynamically enhancing heat transfer through heat pipes

An apparatus for providing a safety and EMC compliant heat sink. The apparatus includes a heat sink configured to be attached to an internal power plane of a printed circuit board (PCB). The heat sink includes a plurality of fins extending outward from the heat sink. The apparatus further includes a compliance cage configured to be connected to a ground portion of the PCB, the compliance cage surrounding at least a portion of the heat sink. At least one capacitor plate contacting at least a portion of the compliance cage and extending inwards towards the heat sink and interleaving with the plurality of fins is present. Dielectric spacers are provided to fill a portion of the space between the capacitor plates and the heat sink fins.

Safety and EMC compliant internal power plane heat sink capacitor

A cable connector for counting a number of plug-in events and preventing further plug in attempts after a threshold number of plug-in events have occurred. An inner sleeve is located inside an outer sleeve, and is designed to move relative to the outer sleeve. The inner sleeve further includes a tab on an outer surface of the inner sleeve. A gear wheel is located inside the outer sleeve and perpendicular to the inner sleeve and has a number of gear teeth. A toggle plug counter rotates the gear wheel one tooth in response to a plug-in action of the cable counter. When the gear wheel rotates to a point where the tab aligns with a notch in the gear wheel an inner spring at the opposite end of the inner sleeve causes the inner sleeve to move through the gear wheel such that further plugging action becomes difficult.

Plug count limiter for cables

A heat sink to selectively dissipate heat from a plurality of heat-generating components. The heat sink includes a plurality of heat pipes, and a base plate configured to locate at least one of the plurality of heat pipes proximate each of the plurality of heat-generating components. The heat sink also includes a plurality of sets of fins operable to dissipate heat generated by the heat-generating components, and a plurality of sets of louvers, wherein each of the plurality of sets of louvers is associated with one of the plurality of sets of fins and is operable to open to selectively allow airflow from outside the heat sink to dissipate heat from one of the plurality of sets of fins.

Configurable multi-chip module heatsink for selective dissipation of heat

A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

Adjustable retention device for heat sink assembly

A latch mechanism includes a mounting bracket, a stop connected to the mounting bracket, a first spring connected to the mounting bracket and in contact with the stop to preload the first spring, and a latch. The latch includes a second spring rotatably connected to the mounting bracket, and a body connected to the second spring. The body includes a pad at one end of the body, and a first pawl at a second end of the body opposite of the pad.

Preloaded flexible latch assembly

A latch assembly includes a lever arm affixed to a latch pivot point of rotation with a cam having a connecting slot. A load mechanism is configured to apply a force on the latch pivot point to retain the lever arm in a first position. The load mechanism is tuned to apply the force along a tolerance range of operation of the latch assembly.

Tunable tolerance stack-compliant latching

A server includes a printed circuit board (PCB), an electronic component connected to the printed circuit board, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a temporary bulkhead that is movable between a deployed position and a stowed position, wherein in the deployed position, the temporary bulkhead is connected to the PCB and extends across the server in a path of the airflow, and wherein in the stowed position, the temporary bulkhead is disconnected from the PCB and is positioned to open the path of the airflow.

Temporary structural bulkhead in an electronic enclosure

An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.

Land grid array electrical contact coating

A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.

Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper

Aspects of this disclosure relate to adjusting the lumen output of a light source. A system may include a light source, a pipe, and at least two light-obscuring elements within the pipe. The pipe may have an inlet port and an outlet port, where the inlet port is configured to be secured to the light source such that all lumens of the light source are directed through an inner passageway of the pipe to the outlet port. The light-obscuring elements may be configured to be moved to reduce a number of lumens of the light source that traverse through the pipe to the outlet port.

Adjusting lumen output of a light assembly

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

Implementing backdrilling elimination utilizing anti-electroplate coating

A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

Forming conductive vias using healing layer

Growing community of inventors

Rochester, MN, United States of America

Kevin O'Connell