Basf Se Corporation

Mine Safety Appliances Company

Kevin M Neigh

Elizabeth R Burkhardt

Karl Matos

Joseph A Corella

Ralph Dieter Maier

John Michael Davis

Kristin Schroeder

Elizabeth Burkhardt

A dual-curable sealant composition includes a polysulfide having an &#x2014;SH group, a metal oxide catalyst, and an alkylborane amine catalyst. A cured sealant is also formed from the dual-curable sealant composition. Moreover, a dual-cured sealant is formed that includes the polymerization product of the polysulfide reacted in the presence of the metal oxide catalyst and the alkylborane amine catalyst. Further, a dual-curable sealant system includes a first component including the polysulfide and the alkylborane amine catalyst and a second component including the metal oxide catalyst. An article is formed that includes a substrate and the cured sealant disposed on the substrate. Even further, a method of forming the dual-curable sealant composition includes the steps of providing the polysulfide, the alkylborane amine catalyst, and the metal oxide catalyst, and combining the polysulfide, the alkylborane amine catalyst, and the metal oxide catalyst to form the dual-curable composition.

Dual-curable sealant composition

The invention relates to new processes to prepare low odor dialkyl sulfides, the low odor dialkyl sulfides obtainable by these processes and to methods of using these low odor dialkyl sulfides. Moreover, the invention relates to a process to prepare dialkyl sulfide borane complexes of high purity, the dialkyl sulfide borane complexes obtainable by this process and to a process for enantioselective reductions employing these dialkyl sulfide borane complexes of high purity as reducing agent.

Process to purify dialkyl sulfides

The present invention provides a method of reducing copper oxide to improve its acid resistance comprising the step of reacting cupric oxide with a reducing agent selected from the group consisting of morpholine borane, ethylene diamine borane, ethylene diamine bisborane, t-butylamine borane, piperazine borane, imidazole borane, and methoxyethylamine borane to form cuprous oxide.

Process for the reduction of copper oxide

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Butler, PA, United States of America

Kevin M Neigh