Northrop Grumman Systems Corporation

University of California

Kevin M Leong

William Roland Deal

Chunbo Zhang

Gershon Akerling

Patty P Chang-Chien

Kelly Jill Hennig

Peter Ngo

Tatsuo Itoh

Cheng-Jung Lee

Shih-En Shih

Ben Gorospe

A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Waveguide and semiconductor packaging

A terahertz waveguide bandpass filter block assembly including a waveguide iris filter, a pedestal block having a pedestal channel including a first one-half portion of the iris filter, and a cover block having a cover channel including a second one-half portion of the iris filter, where the first and second one-half portions combine to define the iris filter having a plurality of poles when the pedestal block and the cover block are secured together. The assembly also includes first and second ribbon strips positioned on opposing sides and adjacent to the iris filter between the pedestal block and the cover block, where a compression force between the pedestal block and the cover block compresses the first and second ribbon strips and sets an 'a' dimension of the iris filter to tune the filter to a frequency band of interest.

Terahertz filter tuning

An apparatus based on composite right-handed or left-handed (CRLH) principles to provide a transmission line or antenna structure having a plurality of cells to which one or more feed ports are attached. The apparatus is based on an equivalent circuit Right-Hand (RH) series induction (L) and shunt capacitor (C), and Left-Hand (LH) series capacitor (C) and induction (L), in which effective permittivity (e) and permeability (m) of the structure are manipulated by the choice of C, L, C, and L. One embodiment describes mushroom antenna cells (D orD array) in which vias extend up from a feed network on a ground plane through at least one dielectric region to each of a first plurality of conductive elements (plates or strips). Optionally, a second plurality of conductive elements are disposed between first and second dielectric layers to form metal-insulator-metal (MIM) capacitors to lower resonance frequency.

Composite right/left-handed transmission line based compact resonant antenna for RF module integration

Growing community of inventors

Los Angeles, CA, United States of America

Kevin M Leong