Micron Technology Incorporated

Round Rock Research, LLC

Keystone Technology Solutions, LLC

Kevin M Devereaux

Brian P Higgins

Mark E Tuttle

John R Tuttle

David K Ovard

George Edward Pax

James E O'Toole

Tyler A Lowrey

Robert R Rotzoll

Shu-Sun Yu

Mark Bunn

Dean D Gans

Tyler A Lowery

A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Radio frequency communications devices

Identification information is wirelessly communicated between radio frequency devices. In one embodiment, a first wireless device transmits a signal to request identification information. Other wireless devices are each affixed a respective item, and each of the other wireless devices determines if a reply signal is to be transmitted, and if so, communicates the reply signal to the first wireless device.

Method and apparatus for wireless communication of identification information between radio frequency devices

In one embodiment, a method includes transmitting a signal from a wireless transmitter to a radio frequency (RF) device of a plurality of RF devices within a communication range of the transmitter. The signal is to select a group of the RF devices. A reply signal is received from each RF device if the respective RF device determines that it is a member of the group.

Radio frequency identification apparatuses

To identify an RFID tag in a field of RFID tags, an interrogator sends a series of commands to implement an arbitration scheme. The commands include differentiation, selection, and modulation information. The tag uses the differentiation information to differentiate commands sent by the interrogator from commands sent by other interrogators that may be within communication range of the tag. The selection information is used by the tag to determine if the tag is a member of a group selected by the interrogator for response to the interrogator. If the tag is a member of the selected group, the tag may send a reply that is modulated using a modulation type selected by the modulation information. In accordance with one of the modulation types, one of three different pulse waveforms is selected by the interrogator via the modulation information to multiply with the baseband waveform of the reply from the tag.

System and method for identifying a radio frequency identification (RFID) device

Radio frequency data communications device

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

An amplifier powered by a selectively engageable voltage source and a method for operating the amplifier. The amplifier includes first and second electrodes for receiving an input signal to be amplified. The first and second electrodes are adapted to be respectively connected to coupling capacitors. The amplifier also includes a differential amplifier having inputs respectively connected to the first and second electrodes, and having an output. The amplifier additionally includes selectively engageable resistances coupled between the voltage source and respective inputs of the differential amplifier and defining, with the coupling capacitors, the high pass characteristics of the circuit. The amplifier further includes second selectively engageable resistances coupled between the voltage source and respective inputs of the differential amplifier. The second resistances respectively have smaller values than the first mentioned resistances, and are engaged and then disengaged in response to the voltage source being engaged.

Method of speeding power-up of an amplifier, and amplifier

The present invention provides a method and apparatus which facilitates wafer level burn-in testing of semiconductor dies. Sacrificial busses on the wafer supply voltage to respective on die Vcc and Vss sacrificial voltage pads during burn-in testing. The Vcc sacrificial pad on each die is connected to a secondary Vcc pad through an on-die sacrificial metal bus. An on-die fuse is interposed between the secondary Vcc pad and a normal Vcc die bonding pad. The fuse will blow when a die draws excessive current isolating a defective die from other dies on the wafer which are connected to the sacrificial busses. The Vss sacrificial pad is connected to a normal Vss die bonding pad through a sacrificial metal bus. After burn-in testing, the structures are removed. During this removal, the on-die sacrificial metal busses protect the secondary Vcc pad and Vss bonding pad. The secondary Vcc pad, Vcc bonding pad and Vss bonding pad can then be exposed for additional die testing.

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Boise, ID, United States of America

Kevin M Devereaux