Globalfoundries Inc.

Kevin M Boyd

Roderick Alan Augur

Jeannine Madelyn Trewhella

Nicholas A Polomoff

Robert Fox

Robert J Fox, Iii

A crack stop structure for an integrated circuit (IC) structure is disclosed. The structure can include: a first crack stop pillar laterally separated from a second crack stop pillar within an insulator region of the IC structure. The first crack stop pillar can include an overlapping via in contact with a top surface and at least one side surface of a first conductive element therebelow. The overlapping via of the first crack stop pillar may be in a given layer of the IC structure, and the second crack stop pillar may include a via in the given layer, the via extending to a different depth than the overlapping via. The via of the second crack stop pillar may be an overlapping via in contact with a top surface and at least one side surface of a second conductive element therebelow.

Crack stop with overlapping vias

One illustrative crack-stop structure disclosed herein may include a first crack-stop metallization layer comprising a first metal line layer that has a plurality of openings formed therein and a second crack-stop metallization layer positioned above and adjacent the first crack-stop metallization layer, wherein the second crack-stop metallization layer has a second metal line layer and a via layer, and wherein the via layer comprises a plurality of vias having a portion that extends at least partially into the openings in the first metal line layer of the first crack-stop metallization layer so as to thereby form a stepped, non-planar interface between the first metal line layer of the first crack-stop metallization layer and the via layer of the second crack-stop metallization layer.

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Ballston Spa, NY, United States of America

Kevin M Boyd