United Technologies Corporation

Raytheon Technologies Corporation

Rtx Corporation

Kevin M Bell

John D Riehl

David R Lyders

Nicholas D Stilin

George Alan Salisbury

Bradley L Paquin

Marc E Holyfiield

Marc E Holyfield

A grounding clip for an organic matrix composite guide vane with a metallic sheath comprises the organic matrix composite guide vane includes a body having a leading edge and a trailing edge opposite the leading edge and a root end extending between the leading end edge and the trailing edge. The metallic sheath is attached proximate the leading edge and extends to the root end. A metallic attachment fitting has a receiver configured to receive the root end of the organic matrix composite guide vane for coupling the organic matrix composite guide vane to the metallic attachment fitting. The grounding clip is coupled to the sheath proximate the root end; wherein the grounding clip is electrically connected to the metallic attachment fitting and the metallic sheath.

Grounding clip for bonded vanes

A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.

Method to integrate multiple electric circuits into organic matrix composite

Growing community of inventors

Higganum, CT, United States of America

Kevin M Bell